Low Drop Voltage Regulators: SMS2907CD-1.8V 500mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V SOT89 AMS Advanced Monolithic Systems AMS2907CD-1.8V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Low Drop Voltage Regulators: SMS2907CD-1.8V 500mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V SOT89 AMS Advanced Monolithic Systems AMS2907CD-1.8V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. SOT89 AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V AMS Advanced Monolithic Systems AMS2907CD-1.8V,SMS2907CD-1.8V,500mA Low Drop Voltage Regulators,,Low Drop Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire Low Drop Voltage Regulators: SMS2907CD-1.8V 500mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V SOT89 AMS Advanced Monolithic Systems AMS2907CD-1.8V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Low Drop Voltage Regulators: SMS2907CD-1.8V 500mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V SOT89 AMS Advanced Monolithic Systems AMS2907CD-1.8V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. SOT89 AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V AMS Advanced Monolithic Systems AMS2907CD-1.8V,SMS2907CD-1.8V,500mA Low Drop Voltage Regulators,,Low Drop Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMS2907CD-1.8V - nanoDFN GOLD CHIP TECHNOLOGY™ SOT89 500mA LOW DROPOUT VOLTAGE REGULATOR FEATURES APPLICATIONS 500mA Low Drop Voltage Regulators - nDFN Three Terminal Adjustable or Fixed Voltages 1.5V, 1.8V, 2.5V, 2.85V, 3.3V and 5.0V Output Current of 500mA Operates Down to 1V Dropout Line Regulation: 0.2% Max. Load Regulation: 0.4% Max. High reliability nanoDFN package Unique 10mils thin design Gold over nickel metallization RoHS compliant, Lead Free Compatible with surface mount, chip and wire and flip chip assembly process. Available packaged in SOT89 High Efficiency Linear Regulators Post Regulators for Switching Supplies 5V to 3.3V Linear Regulator Battery Chargers Sound Cards Power Management for Notebook Battery Powered Instrumentation Chip on Board System in package SIP Hybrid Circuits SMS2907CD-1.8V AMS2907CD-1.8V 500mA LOW DROPOUT VOLTAGE REGULATOR 500mA LOW DROPOUT VOLTAGE REGULATOR - PRODUCT DESCRIPTION SMS2907 series of adjustable and fixed voltage regulators are designed to provide 500mA output current and to operate down to 1V input-TOoutput differential. The dropout voltage of the device is guaranteed maximum 1.3V at maximum output current, decreasing at lower load currents.On-chip trimming adjusts the reference voltage to 1%. Current limit is also trimmed, minimizing the stress under overload conditions on both the regulator and power source circuitry.The SMS2907 devices are pin compatible with other three-terminal regulators and are offered in the low profile surface mount TO252(DPAK), SOT223 and SOT-89 packages. Semiconix Low Drop Voltage Regulators Integrated Circuits series are available in very thin 0201 nanoDFN package. These products are ideal for surface mount, hybrid circuits and multi chip module applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated) Parameter Symbol Value Unit Power Dissipation Internally limited Input Voltage 15 V Storage Temperature -65 to +150 °C Control Section -40° C to 125 °C Power Transistor -40° C to 150 ° C Electrical Characteristics at Name Symbol Test Conditions Value Unit Min. Typ. Max Output Voltage (Note 2) 0≤IOUT≤500mA, 4.35V≤VIN≤12V 1.782 1.8 1.818 V Output Voltage, over the full operating temperature range. 0≤IOUT≤500mA, 4.35V≤VIN≤12V 1.772 1.8 1.828 V Line Regulation 3.0V≤VIN≤12V 0.3 5 mV Line Regulation, over the full operating temperature range. 3.0V≤VIN≤12V 0.6 6 mV Load Regulation, (Notes 2, 3) VIN=5V, 0≤IOUT≤500mA 3 10 mV Load Regulation, over the full operating temperature range. VIN=5V, 0≤IOUT≤500mA 6 20 mV Dropout Voltage (VIN - VOUT) ∆VOUT, ∆VREF=1%, IOUT=500mA (Note 4) 1.1 1.3 V Current Limit (VIN - VOUT)=5V 1 A Minimum Load Current (VIN - VOUT)=12V (Note 5) 5 10 mA Quiescent Current VIN≤12V 5 10 mA Ripple Rejection f=120Hz, COUT=25µF Tantalum, IOUT=500mA,VIN=6V 60 72 dB Thermal Regulation TA=25°C, 30ms pulse 0.008 0.04 %W Adjust Pin Current 10mA≤IOUT≤500mA, 1.5V≤ (VIN - VOUT)≤12V 55 m A Adjust Pin Current, over the full operating temperature range. 10mA≤IOUT≤500mA, 1.5V≤ (VIN - VOUT)≤12V 120 m A Adjust Pin Current Change 10mA≤IOUT≤500mA, 1.5V≤ (VIN - VOUT)≤12V 0.2 5 m A Temperature Stability 0.5 % Long Term Stability TA=125°C, 1000Hrs 0.3 1 % RMS Output Noise (% of VOUT ) TA=25°C, 10Hz≤f≤10kHz 0.003 % Thermal Resistance Junction-to-Case 15 °C/W Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Note 2: Line and Load regulation are guaranteed up to the maximum power dissipation of 1.2W for SOT-223 package and 0.9W for SOT-89 package. Power dissipation is determined by the input/output differential and the output current. Guaranteed maximum power dissipation will not be available over the full input/output range. Note 3: See thermal regulation specifications for changes in output voltage due to heating effects. Line and load regulation are measured at a constant junction temperature by low duty cycle pulse testing. Load regulation is measured at the output lead ~1/8” from the package. Note 4: Dropout voltage is specified over the full output current range of the device. Note 5: Minimum load current is defined as the minimum output current required to maintain regulation. When 1.5V ≤ (VIN - VOUT) ≤ 12V the device is guaranteed to regulate if the output current is greater than 10mA. SPICE MODEL AMS2907CD-1.8V spice model pending. CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V GENERAL DIE INFORMATION Substrate Thickness [mils] Package size Pads dimensions per drawing Backside Silicon Si 10±2 2.03x1.27mm [80x50mils] Gold Tin, Ni/Au, 5µm±1 thickness, solder reflow assembly Optional backside coating and/or marking. LAYOUT / DIMENSIONS / PAD LOCATIONS SMS2907CD-1.8V AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V AMS Advanced Monolithic Systems AMS2907CD-1.8V 500mA LOW DROPOUT VOLTAGE REGULATOR SMS2907CD-1.8V AMS2907CD-1.8V 500mA LOW DROPOUT VOLTAGE REGULATOR SOT89 Package pinout Pin # Function 1 GND/Adj 2 Vin 3 Vout SOT89 SMS2907CD-1.8V AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V AMS Advanced Monolithic Systems AMS2907CD-1.8V 500mA LOW DROPOUT VOLTAGE REGULATOR nanoDFN SMS2907CD-1.8V AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V AMS Advanced Monolithic Systems AMS2907CD-1.8V 500mA LOW DROPOUT VOLTAGE REGULATOR APPLICATION HINTS APPLICATION HINTS The SMS2907 series of adjustable and fixed regulators are easy to use and are protected against short circuit and thermal overloads. Thermal protection circuitry will shut-down the regulator should the junction temperature exceed 165°C at the sense point. Pin compatible with older three terminal adjustable regulators, these devices offer the advantage of a lower dropout voltage, more precise reference tolerance and improved reference stability with temperature. Stability The circuit design used in the SMS2907 series requires the use of an output capacitor as part of the device frequency compensation. The addition of 150?F aluminum electrolytic or a 22?F solid tantalum on the output will ensure stability for all operating conditions. When the adjustment terminal is bypassed with a capacitor to improve the ripple rejection, the requirement for an output capacitor increases. The value of 22µF tantalum or 150µF aluminum covers all cases of bypassing the adjustment terminal. Without bypassing the adjustment terminal smaller capacitors can be used with equally good results. To further improve stability and transient response of these devices larger values of output capacitor can be used. Protection Diodes Unlike older regulators, the SMS2907 family does not need any protection diodes between the adjustment pin and the output and from the output to the input to prevent over-stressing the die. Internal resistors are limiting the internal current paths on the SMS2907 adjustment pin, therefore even with capacitors on the adjustment pin no protection diode is needed to ensure device safety under short-circuit conditions. Diodes between the input and output are not usually needed. Microsecond surge currents of 50A to 100A can be handled by the internal diode between the input and output pins of the device. In normal operations it is difficult to get those values of surge currents even with the use of large output capacitances. If high value output capacitors are used, such as 1000µF to 5000µF and the input pin is instantaneously shorted to ground, damage can occur. A diode from output to input is recommended, when a crowbar circuit at the input of the SMS2907 is used Ripple Rejection The ripple rejection values are measured with the adjustment pin bypassed. The impedance of the adjust pin capacitor at the ripple frequency should be less than the value of R1 (normally 100Ω to 200Ω) for a proper bypassing and ripple rejection approaching the values shown. The size of the required adjust pin capacitor is a function of the input ripple frequency. If R1=100? at 120Hz the adjust pin capacitor should be >13µF. At 10kHz only 0.16µF is needed. The ripple rejection will be a function of output voltage, in circuits without an adjust pin bypass capacitor. The output ripple will increase directly as a ratio of the output voltage to the reference voltage (VOUT / VREF). Output Voltage The SMS2907 series develops a 1.25V reference voltage between the output and the adjust terminal. Placing a resistor between these two terminals causes a constant current to flow through R1 and down through R2 to set the overall output voltage. This current is normally the specified minimum load current of 10mA. Because IADJ is very small and constant it represents a small error and it can usually be ignored. VOUT = VREF (1+ R2/R1)+IadjR2 Load Regulation Load Regulation True remote load sensing it is not possible to provide, because the SMS2907 is a three terminal device. The resistance of the wire connecting the regulator to the load will limit the load regulation. The data sheet specification for load regulation is measured at the bottom of the package. Negative side sensing is a true Kelvin connection, with the bottom of the output divider returned to the negative side of the load. The best load regulation is obtained when the top of the resistor divider R1 is connected directly to the case not to the load. If R1 were connected to the load, the effective resistance between the regulator and the load would be: RP x ( R2+R1 ) , RP = Parasitic Line Resistance R1 CONNECT R1 TO CASE CONNECT R2 TO LOAD Connected as shown, RP is not multiplied by the divider ratio. Using 16-gauge wire the parasitic line resistance is about 0.004.per foot, translating to 4mV/ft at 1A load current. It is important to keep the positive lead between regulator and load as short as possible and use large wire or PC board traces. In the case of fixed voltage devices the top of R1 is connected Kelvin internally, and the ground pin can be used for negative side sensing. Thermal Considerations The SMS2907 series have internal power and thermal limiting circuitry designed to protect the device under overload conditions. However maximum junction temperature ratings of 125°C should not be exceeded under continuous normal load conditions. Careful consideration must be given to all sources of thermal resistance from junction to ambient. For the surface mount package SOT-223 additional heat sources mounted near the device must be considered. The heat dissipation capability of the PC board and its copper traces is used as a heat sink for the device. The thermal resistance from the junction to the tab for the SMS2907 is 15°C/W. Thermal resistance from tab to ambient can be as low as 30°C/W. The total thermal resistance from junction to ambient can be as low as 45°C/W. This requires a reasonable sized PC board with at least on layer of copper to spread the heat across the board and couple it into the surrounding air. Experiments have shown that the heat spreading copper layer does not need to be electrically connected to the tab of the device. The PC material can be very effective at transmitting heat between the pad area, attached to the pad of the device, and a ground plane layer either inside or on the opposite side of the board. Although the actual thermal resistance of the PC material is high, the Length/Area ratio of the thermal resistance between layers is small. The data in Table 1, was taken using 1/16” FR-4 board with 1 oz. copper foil, and it can be used as a rough guideline for estimating thermal resistance. For each application the thermal resistance will be affected by thermal interactions with other components on the board. To determine the actual value some experimentation will be necessary. The power dissipation of the SMS2907 is equal to: PD = ( VIN - VOUT )( IOUT ) Maximum junction temperature will be equal to: TJ = TA(MAX) + PD(Thermal Resistance (junction-to-ambient)) Maximum junction temperature must not exceed 125°C. Vout Basic Adjustable Regulator Figure 1: Vout Basic Adjustable Regulator Protection diodes Figure 2: Protection diodes Connections for Best Load Regulation Figure 3: Connections for Best Load Regulation SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE SMX-nDFN - NanoDFN package is a very thin (10mils) proprietary wafer level chip size package W-CSP technology developed by Semiconix. SMX-nDFN is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at >220°C, clean, etc. SMX-nDFN packages can also be attached with conductive silver epoxy in low temperature applications. The assembly process is also very simple and inexpensive consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. SMX-nDFN packages are available in many sizes with landing pads compatible with the industry standard CSP as well as many surface mount packages. STANDARD PRODUCTS ORDERING INFORMATION VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) TAPE / REEL MIN QUANTITY U/P($) nDFN-4 SMS2907CD-1.8V-nDFN-4 -WP 1000 -TR 1000 nDFN-4 SMS2907CD-1.8V-nDFN-4 -WP 5000 -TR 5000 SOT89 SMS2907CD-1.8V-SOT89 -WP 1000 -TR 5000 PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice. LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated:January 01, 1970 Display settings for best viewing: Current display settings: Page hits: 1 Screen resolution: 1124x864 Screen resolution: Total site visits: 1 Color quality: 16 bit Color quality: bit © 1990-2009 SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission.

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semiconix semiconductor - where the future is today - gold chip technology SMS2907CD-1.8V - nanoDFN
GOLD CHIP TECHNOLOGY™ SOT89 500mA LOW DROPOUT VOLTAGE REGULATOR

FEATURES APPLICATIONS 500mA Low Drop Voltage Regulators - nDFN
Three Terminal Adjustable or Fixed Voltages
1.5V, 1.8V, 2.5V, 2.85V, 3.3V and 5.0V
Output Current of 500mA
Operates Down to 1V Dropout
Line Regulation: 0.2% Max.
Load Regulation: 0.4% Max.
High reliability nanoDFN package
Unique 10mils thin design
Gold over nickel metallization
RoHS compliant, Lead Free
Compatible with surface mount, chip and wire and flip chip assembly process.
Available packaged in SOT89
High Efficiency Linear Regulators
Post Regulators for Switching Supplies
5V to 3.3V Linear Regulator
Battery Chargers
Sound Cards
Power Management for Notebook
Battery Powered Instrumentation
Chip on Board
System in package SIP
Hybrid Circuits
SMS2907CD-1.8V AMS2907CD-1.8V 500mA LOW DROPOUT VOLTAGE REGULATOR

500mA LOW DROPOUT VOLTAGE REGULATOR - PRODUCT DESCRIPTION
SMS2907 series of adjustable and fixed voltage regulators are designed to provide 500mA output current and to operate down to 1V input-TOoutput differential. The dropout voltage of the device is guaranteed maximum 1.3V at maximum output current, decreasing at lower load currents.On-chip trimming adjusts the reference voltage to 1%. Current limit is also trimmed, minimizing the stress under overload conditions on both the regulator and power source circuitry.The SMS2907 devices are pin compatible with other three-terminal regulators and are offered in the low profile surface mount TO252(DPAK), SOT223 and SOT-89 packages.
Semiconix Low Drop Voltage Regulators Integrated Circuits series are available in very thin 0201 nanoDFN package.
These products are ideal for surface mount, hybrid circuits and multi chip module applications.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS
Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions.

ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated)
Parameter Symbol Value Unit
Power Dissipation Internally limited
Input Voltage 15 V
Storage Temperature -65 to +150 °C
Control Section -40° C to 125 °C
Power Transistor -40° C to 150 ° C

Electrical Characteristics at
Name Symbol Test Conditions Value Unit
Min. Typ. Max
Output Voltage (Note 2) 0≤IOUT≤500mA, 4.35V≤VIN≤12V 1.782 1.8 1.818 V
Output Voltage, over the full operating temperature range. 0≤IOUT≤500mA, 4.35V≤VIN≤12V 1.772 1.8 1.828 V
Line Regulation 3.0V≤VIN≤12V 0.3 5 mV
Line Regulation, over the full operating temperature range. 3.0V≤VIN≤12V 0.6 6 mV
Load Regulation, (Notes 2, 3) VIN=5V, 0≤IOUT≤500mA 3 10 mV
Load Regulation, over the full operating temperature range. VIN=5V, 0≤IOUT≤500mA 6 20 mV
Dropout Voltage (VIN - VOUT) ∆VOUT, ∆VREF=1%, IOUT=500mA (Note 4) 1.1 1.3 V
Current Limit (VIN - VOUT)=5V 1 A
Minimum Load Current (VIN - VOUT)=12V (Note 5) 5 10 mA
Quiescent Current VIN≤12V 5 10 mA
Ripple Rejection f=120Hz, COUT=25µF Tantalum, IOUT=500mA,VIN=6V 60 72 dB
Thermal Regulation TA=25°C, 30ms pulse 0.008 0.04 %W
Adjust Pin Current 10mA≤IOUT≤500mA, 1.5V≤ (VIN - VOUT)≤12V 55 m A
Adjust Pin Current, over the full operating temperature range. 10mA≤IOUT≤500mA, 1.5V≤ (VIN - VOUT)≤12V 120 m A
Adjust Pin Current Change 10mA≤IOUT≤500mA, 1.5V≤ (VIN - VOUT)≤12V 0.2 5 m A
Temperature Stability 0.5 %
Long Term Stability TA=125°C, 1000Hrs 0.3 1 %
RMS Output Noise (% of VOUT ) TA=25°C, 10Hz≤f≤10kHz 0.003 %
Thermal Resistance Junction-to-Case 15 °C/W
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. For guaranteed specifications and test conditions, see the
Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed.
Note 2: Line and Load regulation are guaranteed up to the maximum power dissipation of 1.2W for SOT-223 package and 0.9W for SOT-89 package. Power
dissipation is determined by the input/output differential and the output current. Guaranteed maximum power dissipation will not be available over the full
input/output range.
Note 3: See thermal regulation specifications for changes in output voltage due to heating effects. Line and load regulation are measured at a constant junction
temperature by low duty cycle pulse testing. Load regulation is measured at the output lead ~1/8” from the package.
Note 4: Dropout voltage is specified over the full output current range of the device.
Note 5: Minimum load current is defined as the minimum output current required to maintain regulation. When 1.5V ≤ (VIN - VOUT) ≤ 12V the device is
guaranteed to regulate if the output current is greater than 10mA.
SPICE MODEL
Spice model pending.
CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Package size Pads dimensions per drawing Backside
Silicon
Si
10±2 2.03x1.27mm
[80x50mils]
Gold Tin, Ni/Au, 5µm±1 thickness, solder reflow assembly Optional backside coating and/or marking.

LAYOUT / DIMENSIONS / PAD LOCATIONS
SMS2907CD-1.8V AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V AMS Advanced Monolithic Systems AMS2907CD-1.8V 500mA LOW DROPOUT VOLTAGE REGULATOR SMS2907CD-1.8V AMS2907CD-1.8V 500mA LOW DROPOUT VOLTAGE REGULATOR
SOT89 Package pinout
Pin # Function
1 GND/Adj
2 Vin
3 Vout
SOT89 SMS2907CD-1.8V AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V AMS Advanced Monolithic Systems AMS2907CD-1.8V 500mA LOW DROPOUT VOLTAGE REGULATOR
nanoDFN SMS2907CD-1.8V AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V, AMS Advanced Monolithic Systems AMS2907CD-1.8V AMS Advanced Monolithic Systems AMS2907CD-1.8V 500mA LOW DROPOUT VOLTAGE REGULATOR

APPLICATION HINTS

APPLICATION HINTS 


The SMS2907 series of adjustable and fixed regulators are easy to use and are protected against short circuit and thermal overloads. Thermal protection circuitry will shut-down the regulator should the junction temperature exceed 165°C at the sense point.
Pin compatible with older three terminal adjustable regulators, these devices offer the advantage of a lower dropout voltage, more precise reference tolerance and improved reference stability with temperature.

Stability
The circuit design used in the SMS2907 series requires the use of an output capacitor as part of the device frequency compensation. The addition of 150?F aluminum electrolytic or a 22?F solid tantalum on the output will ensure stability for all operating conditions.
When the adjustment terminal is bypassed with a capacitor to improve the ripple rejection, the requirement for an output capacitor increases. The value of 22µF tantalum or 150µF aluminum covers all cases of bypassing the adjustment terminal. Without bypassing the adjustment terminal smaller capacitors can be used with equally good results.
To further improve stability and transient response of these devices larger values of output capacitor can be used.

Protection Diodes
Unlike older regulators, the SMS2907 family does not need any protection diodes between the adjustment pin and the output and from the output to the input to prevent over-stressing the die.
Internal resistors are limiting the internal current paths on the SMS2907 adjustment pin, therefore even with capacitors on the adjustment pin no protection diode is needed to ensure device safety under short-circuit conditions.
Diodes between the input and output are not usually needed. Microsecond surge currents of 50A to 100A can be handled by the internal diode between the input and output pins of the device. In normal operations it is difficult to get those values of surge currents even with the use of large output capacitances. If high value output capacitors are used, such as 1000µF to 5000µF and the input pin is instantaneously shorted to ground, damage can occur. A diode from output to input is recommended, when a crowbar circuit at the input of the SMS2907 is used

Ripple Rejection
The ripple rejection values are measured with the adjustment pin bypassed. The impedance of the adjust pin capacitor at the ripple frequency should be less than the value of R1 (normally 100Ω to 200Ω) for a proper bypassing and ripple rejection approaching the values shown. The size of the required adjust pin capacitor is a function of the input ripple frequency. If R1=100? at 120Hz the adjust pin capacitor should be >13µF. At 10kHz only 0.16µF is needed.
The ripple rejection will be a function of output voltage, in circuits without an adjust pin bypass capacitor. The output ripple will increase directly as a ratio of the output voltage to the reference voltage (VOUT / VREF).

Output Voltage
The SMS2907 series develops a 1.25V reference voltage between the output and the adjust terminal. Placing a resistor between these two terminals causes a constant current to flow through R1 and down through R2 to set the overall output voltage. This current is normally the specified minimum load current of 10mA. Because IADJ is very small and constant it represents a small error and it can usually be ignored.
VOUT = VREF (1+ R2/R1)+IadjR2

Load Regulation
Load Regulation
True remote load sensing it is not possible to provide, because the SMS2907 is a three terminal device. The resistance of the wire connecting the regulator to the load will limit the load regulation. The data sheet specification for load regulation is measured at the bottom of the package. Negative side sensing is a true Kelvin connection, with the bottom of the output divider returned to the negative side of the load.
The best load regulation is obtained when the top of the resistor divider R1 is connected directly to the case not to the load. If R1 were connected to the load, the effective resistance between the regulator and the load would be:
RP x ( R2+R1 ) , RP = Parasitic Line Resistance R1
CONNECT R1 TO CASE CONNECT R2 TO LOAD
Connected as shown, RP is not multiplied by the divider ratio. Using 16-gauge wire the parasitic line resistance is about 0.004.per foot, translating to 4mV/ft at 1A load current. It is important to keep the positive lead between regulator and load as short as possible and use large wire or PC board traces.
In the case of fixed voltage devices the top of R1 is connected Kelvin internally, and the ground pin can be used for negative side sensing.

Thermal Considerations
The SMS2907 series have internal power and thermal limiting circuitry designed to protect the device under overload conditions.
However maximum junction temperature ratings of 125°C should not be exceeded under continuous normal load conditions.
Careful consideration must be given to all sources of thermal resistance from junction to ambient. For the surface mount package SOT-223 additional heat sources mounted near the device must be considered. The heat dissipation capability of the PC board and its copper traces is used as a heat sink for the device.
The thermal resistance from the junction to the tab for the SMS2907 is 15°C/W. Thermal resistance from tab to ambient can be as low as 30°C/W.
The total thermal resistance from junction to ambient can be as low as 45°C/W. This requires a reasonable sized PC board with at least on layer of copper to spread the heat across the board and couple it into the surrounding air.
Experiments have shown that the heat spreading copper layer does not need to be electrically connected to the tab of the device. The PC material can be very effective at transmitting heat between the pad area, attached to the pad of the device, and a ground plane layer either inside or on the opposite side of the board. Although the actual thermal resistance of the PC material is high, the Length/Area ratio of the thermal resistance between layers is small. The data in Table 1, was taken using 1/16 FR-4 board with 1 oz. copper foil, and it can be used as a rough guideline for estimating thermal resistance.
For each application the thermal resistance will be affected by thermal interactions with other components on the board. To determine the actual value some experimentation will be necessary.
The power dissipation of the SMS2907 is equal to:
PD = ( VIN - VOUT )( IOUT )
Maximum junction temperature will be equal to:
TJ = TA(MAX) + PD(Thermal Resistance (junction-to-ambient))
Maximum junction temperature must not exceed 125°C.
Vout Basic Adjustable Regulator
Figure 1: Vout Basic Adjustable Regulator
Protection diodes
Figure 2: Protection diodes
Connections for Best Load Regulation
Figure 3: Connections for Best Load Regulation

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
SMX-nDFN - NanoDFN package is a very thin (10mils) proprietary wafer level chip size package W-CSP technology developed by Semiconix.
SMX-nDFN is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at >220°C, clean, etc.
SMX-nDFN packages can also be attached with conductive silver epoxy in low temperature applications. The assembly process is also very simple and inexpensive consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. SMX-nDFN packages are available in many sizes with landing pads compatible with the industry standard CSP as well as many surface mount packages.

STANDARD PRODUCTS ORDERING INFORMATION

VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) TAPE / REEL MIN QUANTITY U/P($)
nDFN-4 SMS2907CD-1.8V-nDFN-4 -WP 1000 -TR 1000
nDFN-4 SMS2907CD-1.8V-nDFN-4 -WP 5000 -TR 5000
SOT89 SMS2907CD-1.8V-SOT89 -WP 1000 -TR 5000

PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.
LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times.
CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met.
CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page.
SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.
ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts.
SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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