Low Drop Voltage Regulators: SMS2930AS-2V 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED same as AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V TO220 AMS Advanced Monolithic Systems AMS2930AS-2V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Low Drop Voltage Regulators: SMS2930AS-2V 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED same as AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V TO220 AMS Advanced Monolithic Systems AMS2930AS-2V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. TO220 AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V,SMS2930AS-2V,150mA Low Drop Voltage Regulators,,Low Drop Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire Low Drop Voltage Regulators: SMS2930AS-2V 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED same as AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V TO220 AMS Advanced Monolithic Systems AMS2930AS-2V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Low Drop Voltage Regulators: SMS2930AS-2V 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED same as AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V TO220 AMS Advanced Monolithic Systems AMS2930AS-2V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. TO220 AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V,SMS2930AS-2V,150mA Low Drop Voltage Regulators,,Low Drop Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMS2930AS-2V - FLIP CHIP GOLD CHIP TECHNOLOGY™ 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED FEATURES APPLICATIONS 150mA Low Drop Voltage Regulators - FLIP CHIP Fixed and Adjustable Versions Available Output Current in excess of 150mA Very Low Quiescent Current Reverse Battery Protection Input-output Differential less than 0.6V Short Circuit protection Internal Thermal Overload Protection 60V Load Dump Protection -50V Reverse Transient Protection Mirror Image Insertion Protection High reliability Unique new design in 1206 style case Gold metallization RoHS compliant, Lead Free Compatible with both chip and wire, flip chip and surface mount assembly. Battery Powered Systems Portable Consumer Equipment Cordless Telephones Portable (Notebook) Computers Portable Instrumentation Radio Control Systems Automotive Electronics Chip on Board System in package SIP Hybrid Circuits SMS2930AS-2V AMS2930AS-2V 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED - PRODUCT DESCRIPTION SMS2930 series consists of positive fixed and adjustable voltage regulators ideally suited for use in battery-powered systems. These devices feature very low quiescent current of 1mA or less when supplying 10mA loads. This unique characteristic and the extremely low input -output differential required for proper regulation (0.2V for output currents of 10mA) make the SMS2930 ideal to use for standby power systems. Originally designed for automotive applications, the SMS2930 and all regulated circuitry are protected from input fault conditions caused by reverse battery installation or two battery jump starts. During line transients, such as load dump (60V) when the input voltage to the regulator can momentarily exceed the specified maximum operating voltage, the regulator will automatically shut down to protect both internal circuits and the load. The SMS2930 series also includes internal current limiting, thermal shutdown, and is able to withstand temporary power-up with mirror-image insertion. The SMS2930 is offered in the 3-pin TO-92 package, 8-pin plastic SOIC, TO-220 and TO-263 packages. Flip Chip Low Drop Voltage Regulators Integrated Circuits series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated) Parameter Symbol Value Unit Power Dissipation Internally limited Input Voltage 26 V Overvoltage Protection 60 V Reverse Voltage (DC) -6 V Storage Temperature -65 to +150 °C Operating Junction Temperature 125 °C Electrical Characteristics at VIN=14V, TJ=25°C, C2= 100µF unless otherwise specified. Name Symbol Test Conditions Value Unit Min. Typ. Max Output Voltage Tolerance -1 1 % Output Voltage Tolerance 6V ≤VIN ≤26V, IO=100 mA,-40°C ≤TJ ≤125°C -3 3 % Line Regulation 9V ≤VIN ≤ 16V 2 10 mV Line Regulation, over the full operating temperature range. 6V ≤VIN ≤ 26V 4 30 mV Load Regulation,(Notes 2, 3) 5mA ≤IO ≤ 150 mA 14 50 mV Dropout Voltage(VIN - VOUT) IO= 10 mA 0.05 0.2 mV Dropout Voltage(VIN - VOUT) IO= 150 mA 0.3 0.6 mV Quiescent Current IO ≤ 10 mA, 6V ≤ VIN ≤ 26V,-40°C ≤TJ ≤ 125°C 0.4 1 mA Quiescent Current IO= 150 mA, VIN= 14V, TJ= 25°C 5 15 30 mA Ripple Rejection fO=120Hz 55 80 dB Output Noise Voltage 10Hz-100kHz, COUT= 100µA 500 µV rms Output Impedance 100mADC and 10mArms,100Hz=10kHz 160 200 mW Maximum Operational Input Voltage 26 33 V Maximum Line Transient RL= 500Ω, VO ≤ 5.5V,T= 1ms, τ ≤100ms 60 70 V Reverse Polarity Input Voltage,D/C -15 -30 V Reverse Polarity Input Voltage,Transient RL= 500Ω, T= 1ms, τ ≤100ms -50 -80 V Long Term Stability T=1000hr 20 mV Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: See Circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used. Note 3: Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for TA = TJ = 25°C. Note 4: The junction-to-ambient thermal resistance are as follows: 195°C/W for the TO-92 (N) package, 160°C/W for the molded plastic SO-8 (S), 50°C/W for the TO-220 package and 73°C/W for the TO-263 package. If the TO-220 package is used with a heat sink, θJA is the sum of the package thermal resistance junction-to-case of 3°C/W and the thermal resistance added by the heat sink and the thermal interface. The thermal resistance of the TO-263 package can be reduced by increasing the PCB copper area thermally connected to the package: using 0.5 square inches of copper area, ϕ JA is 50°C/W; with 1 square inch of copper area ϕ JA is 37°C/W; and with 1.6 or more square inches of copper area ϕ JA is 32°C/W. SPICE MODEL AMS2930AS-2V spice model pending. CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V GENERAL DIE INFORMATION Substrate Thickness [mils] Size LxW[mils] Bonding pads dimensions per drawing Backside Silicon Si 10±2 73.6x56.7±1 [1.87x1.44±0.025] Type Pad metal Thickness Assembly -FC TiW/Au 4µm±1 Wire bonding or Silver epoxy -GB TiW/Au 25µm±2.5 Thermosonic -GT Ti/Pt/AuSn 5µm±1 Reflow -AN Ni/Au 5µm±1 Solder reflow Optional backside coating and/or marking. LAYOUT / DIMENSIONS / PAD LOCATIONS Click to select process: -FC -GB -GT -AN SMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED SMS2930AS-2V AMS2930AS-2V 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED wire bonding SMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXEDthermosonic SMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXEDthermal SMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXEDsolder reflow SMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED APPLICATION HINTS TYPICAL APPLICATIONS Fixed Output Input capacitor equired if regulator is located far from power supply filter. Output capacitor must be at least 100µF to maintain stability; it can be increased without bound to maintain regulation during transients and it should be located as close as possible to the regulator. This capacitor must be rated over the same operating temperature range like the regulator. The ESR of this capacitor is critical (see curve) and it should by less than 1Ω over the expected operating temperature range. Adjustable Output Vout=Vref × (1+R2/R1) Using 27k for R1 will automatically compensate for errors in Vout due to the input bias current of the Adjust Pin ( approx. 1µA). APPLICATION HINTS The AMS2930 series require an output capacitor for device stability. The value required depends on the application circuit and other factors. Because high frequency characteristics of electrolytic capacitors depend greatly on the type and even the manufacturer, the value of capacitance that works well with AMS2930 for one brand or type may not necessary be sufficient with an electrolytic of different origin. Sometimes actual bench testing will be the only means to determine the proper capacitor type and value. To obtain stability in all general applications a high quality 100µF aluminum electrolytic or a 47µF tantalum electrolytic can be used. A critical characteristic of the electrolytic capacitors is their performance over temperature. The AMS2930 is designed to operate to -40°C, but some electrolytics will freeze around -30°C therefore becoming ineffective. In such case the result is oscillation at the regulator output. For all application circuits where cold operation is necessary, the output capacitor must be rated to operate at the minimum temperature. In applications where the regulator junction temperature will never be lower than 25°C the output capacitor value can be reduced by a factor of two over the value required for the entire temperature range (47µF for a high quality aluminum or 22µF for a tantalum electrolytic capacitor). With higher output currents, the stability of AMS2930 decreases. Considering the fact that in many applications the AMS2930 is operated at only a few milliamps (or less) of output current, the output capacitor value can be reduced even further. For example, a circuit that is required to deliver a maximum of 10mA of output current from the regulator output will need an output capacitor of only half the value compared to the same regulator required to deliver the full output current of 150mA. In the case of AMS2930C (adjustable), the minimum value of output capacitance is a function of the output voltage. As a general rule, with higher output voltages the value of the output capacitance decreases, since the internal loop gain is reduced. In order to determine the minimum value of the output capacitor, for an application circuit, the entire circuit including the capacitor should be bench tested at minimum operating temperatures and maximum operating currents. To maintain internal power dissipation and die heating to a minimum, the input voltage should be maintain at 0.6V above the output. Worst-case occurs just after input power is applied and before the die had the chance to heatup. After the minimum capacitance value has been found for the specific brand and type of electrolytic capacitor, the value should be doubled for actual use to cover for production variations both in the regulator and the capacitor. Typical Application - Fixed Output Figure 1: Typical Application - Fixed Output Typical Application - Adjustable Output Figure 2: Typical Application - Adjustable Output SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. Semiconix Flip Chip -FC series can be also used for thermosonic wire bonding. Semiconix Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. Semiconix Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process. Semiconix -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications. Semiconix Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc. Semiconix Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages. STANDARD PRODUCTS ORDERING INFORMATION VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($) Flip chip SMS2930AS-2V-FC -WP 1000 -FF 1000 Flip chip SMS2930AS-2V-FC -WP 5000 -FF 5000 Gold Bump SMS2930AS-2V-GB -WP 1000 -FF 1000 Gold Bump SMS2930AS-2V-GB -WP 5000 -FF 5000 Gold-Tin SMS2930AS-2V-GT -WP 1000 -FF 1000 Gold-Tin SMS2930AS-2V-GT -WP 5000 -FF 5000 Gold/Nickel SMS2930AS-2V-AN -WP 1000 -FF 1000 Gold/Nickel SMS2930AS-2V-AN -WP 5000 -FF 5000 PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice. LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated:January 01, 1970 Display settings for best viewing: Current display settings: Page hits: 1 Screen resolution: 1124x864 Screen resolution: Total site visits: 1 Color quality: 16 bit Color quality: bit © 1990-2009 SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission.

REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP

   
semiconix semiconductor - where the future is today - gold chip technology SMS2930AS-2V - FLIP CHIP
GOLD CHIP TECHNOLOGY™ 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED

FEATURES APPLICATIONS 150mA Low Drop Voltage Regulators - FLIP CHIP
Fixed and Adjustable Versions Available
Output Current in excess of 150mA
Very Low Quiescent Current
Reverse Battery Protection
Input-output Differential less than 0.6V
Short Circuit protection
Internal Thermal Overload Protection
60V Load Dump Protection
-50V Reverse Transient Protection
Mirror Image Insertion Protection
High reliability
Unique new design in 1206 style case
Gold metallization
RoHS compliant, Lead Free
Compatible with both chip and wire, flip chip and surface mount assembly.
Battery Powered Systems
Portable Consumer Equipment
Cordless Telephones
Portable (Notebook) Computers
Portable Instrumentation
Radio Control Systems
Automotive Electronics
Chip on Board
System in package SIP
Hybrid Circuits
SMS2930AS-2V AMS2930AS-2V 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED

150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED - PRODUCT DESCRIPTION
SMS2930 series consists of positive fixed and adjustable voltage regulators ideally suited for use in battery-powered systems. These devices feature very low quiescent current of 1mA or less when supplying 10mA loads. This unique characteristic and the extremely low input -output differential required for proper regulation (0.2V for output currents of 10mA) make the SMS2930 ideal to use for standby power systems. Originally designed for automotive applications, the SMS2930 and all regulated circuitry are protected from input fault conditions caused by reverse battery installation or two battery jump starts. During line transients, such as load dump (60V) when the input voltage to the regulator can momentarily exceed the specified maximum operating voltage, the regulator will automatically shut down to protect both internal circuits and the load. The SMS2930 series also includes internal current limiting, thermal shutdown, and is able to withstand temporary power-up with mirror-image insertion. The SMS2930 is offered in the 3-pin TO-92 package, 8-pin plastic SOIC, TO-220 and TO-263 packages.
Flip Chip Low Drop Voltage Regulators Integrated Circuits series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS
Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions.

ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated)
Parameter Symbol Value Unit
Power Dissipation Internally limited
Input Voltage 26 V
Overvoltage Protection 60 V
Reverse Voltage (DC) -6 V
Storage Temperature -65 to +150 °C
Operating Junction Temperature 125 °C

Electrical Characteristics at VIN=14V, TJ=25°C, C2= 100µF unless otherwise specified.
Name Symbol Test Conditions Value Unit
Min. Typ. Max
Output Voltage Tolerance -1 1 %
Output Voltage Tolerance 6V ≤VIN ≤26V, IO=100 mA,-40°C ≤TJ ≤125°C -3 3 %
Line Regulation 9V ≤VIN ≤ 16V 2 10 mV
Line Regulation, over the full operating temperature range. 6V ≤VIN ≤ 26V 4 30 mV
Load Regulation,(Notes 2, 3) 5mA ≤IO ≤ 150 mA 14 50 mV
Dropout Voltage(VIN - VOUT) IO= 10 mA 0.05 0.2 mV
Dropout Voltage(VIN - VOUT) IO= 150 mA 0.3 0.6 mV
Quiescent Current IO ≤ 10 mA, 6V ≤ VIN ≤ 26V,-40°C ≤TJ ≤ 125°C 0.4 1 mA
Quiescent Current IO= 150 mA, VIN= 14V, TJ= 25°C 5 15 30 mA
Ripple Rejection fO=120Hz 55 80 dB
Output Noise Voltage 10Hz-100kHz, COUT= 100µA 500 µV rms
Output Impedance 100mADC and 10mArms,100Hz=10kHz 160 200 mW
Maximum Operational Input Voltage 26 33 V
Maximum Line Transient RL= 500Ω, VO ≤ 5.5V,T= 1ms, τ ≤100ms 60 70 V
Reverse Polarity Input Voltage,D/C -15 -30 V
Reverse Polarity Input Voltage,Transient RL= 500Ω, T= 1ms, τ ≤100ms -50 -80 V
Long Term Stability T=1000hr 20 mV
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. For guaranteed performance limits and associated test
conditions, see the Electrical Characteristics tables.
Note 2: See Circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
Note 3: Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for
TA = TJ = 25°C.
Note 4: The junction-to-ambient thermal resistance are as follows: 195°C/W for the TO-92 (N) package, 160°C/W for the molded plastic SO-8 (S), 50°C/W for
the TO-220 package and 73°C/W for the TO-263 package. If the TO-220 package is used with a heat sink, θJA is the sum of the package thermal resistance
junction-to-case of 3°C/W and the thermal resistance added by the heat sink and the thermal interface. The thermal resistance of the TO-263 package can be
reduced by increasing the PCB copper area thermally connected to the package: using 0.5 square inches of copper area, ϕ JA is 50°C/W; with 1 square inch of
copper area ϕ JA is 37°C/W; and with 1.6 or more square inches of copper area ϕ JA is 32°C/W.
SPICE MODEL
Spice model pending.
CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Size
LxW[mils]
Bonding pads dimensions per drawing Backside
Silicon
Si
10±2 73.6x56.7±1
[1.87x1.44±0.025]
TypePad metalThicknessAssembly
-FCTiW/Au4µm±1Wire bonding or Silver epoxy
-GBTiW/Au25µm±2.5Thermosonic
-GTTi/Pt/AuSn5µm±1Reflow
-ANNi/Au5µm±1Solder reflow
Optional backside coating and/or marking.

LAYOUT / DIMENSIONS / PAD LOCATIONS
Click to select process: -FC -GB -GT -AN
SMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED SMS2930AS-2V AMS2930AS-2V 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED
wire bonding SMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V, AMS Advanced Monolithic Systems AMS2930AS-2V AMS Advanced Monolithic Systems AMS2930AS-2V 150mA LOW DROPOUT VOLTAGE REGULATOR,OUTPUT VOLTAGE FIXED

APPLICATION HINTS

TYPICAL APPLICATIONS


Fixed Output
Input capacitor equired if regulator is located far from power supply filter.
Output capacitor must be at least 100µF to maintain stability; it can be increased without bound to maintain regulation during transients and it should be located as close as possible to the regulator. This capacitor must be rated over the same operating temperature range like the regulator. The ESR of this capacitor is critical (see curve) and it should by less than 1Ω over the expected operating temperature range.

Adjustable Output
Vout=Vref (1+R2/R1)
Using 27k for R1 will automatically compensate for errors in Vout due to the input bias current of the Adjust Pin ( approx. 1µA).

APPLICATION HINTS
The AMS2930 series require an output capacitor for device stability. The value required depends on the application circuit and other factors.
Because high frequency characteristics of electrolytic capacitors depend greatly on the type and even the manufacturer, the value of capacitance that works well with AMS2930 for one brand or type may not necessary be sufficient with an electrolytic of different origin. Sometimes actual bench testing will be the only means to determine the proper capacitor type and value. To obtain stability in all general applications a high quality 100µF aluminum electrolytic or a 47µF tantalum electrolytic can be used.
A critical characteristic of the electrolytic capacitors is their performance over temperature. The AMS2930 is designed to operate to -40°C, but some electrolytics will freeze around -30°C therefore becoming ineffective. In such case the result is oscillation at the regulator output. For all application circuits where cold operation is necessary, the output capacitor must be rated to operate at the minimum temperature. In applications where the regulator junction temperature will never be lower than 25°C the output capacitor value can be reduced by a factor of two over the value required for the entire temperature range (47µF for a high quality aluminum or 22µF for a tantalum electrolytic capacitor).
With higher output currents, the stability of AMS2930 decreases.
Considering the fact that in many applications the AMS2930 is operated at only a few milliamps (or less) of output current, the output capacitor value can be reduced even further. For example, a circuit that is required to deliver a maximum of 10mA of output current from the regulator output will need an output capacitor of only half the value compared to the same regulator required to deliver the full output current of 150mA.
In the case of AMS2930C (adjustable), the minimum value of output capacitance is a function of the output voltage. As a general rule, with higher output voltages the value of the output capacitance decreases, since the internal loop gain is reduced.
In order to determine the minimum value of the output capacitor, for an application circuit, the entire circuit including the capacitor should be bench tested at minimum operating temperatures and maximum operating currents. To maintain internal power dissipation and die heating to a minimum, the input voltage should be maintain at 0.6V above the output. Worst-case occurs just after input power is applied and before the die had the chance to heatup. After the minimum capacitance value has been found for the specific brand and type of electrolytic capacitor, the value should be doubled for actual use to cover for production variations both in the regulator and the capacitor.
Typical Application - Fixed Output
Figure 1: Typical Application - Fixed Output
Typical Application - Adjustable Output
Figure 2: Typical Application - Adjustable Output

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
Semiconix flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. Semiconix Flip Chip -FC series can be also used for thermosonic wire bonding. Semiconix Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. Semiconix Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process.
Semiconix -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications.
Semiconix Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc.
Semiconix Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages.

STANDARD PRODUCTS ORDERING INFORMATION

VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($)
Flip chip SMS2930AS-2V-FC -WP 1000 -FF 1000
Flip chip SMS2930AS-2V-FC -WP 5000 -FF 5000
Gold Bump SMS2930AS-2V-GB -WP 1000 -FF 1000
Gold Bump SMS2930AS-2V-GB -WP 5000 -FF 5000
Gold-Tin SMS2930AS-2V-GT -WP 1000 -FF 1000
Gold-Tin SMS2930AS-2V-GT -WP 5000 -FF 5000
Gold/Nickel SMS2930AS-2V-AN -WP 1000 -FF 1000
Gold/Nickel SMS2930AS-2V-AN -WP 5000 -FF 5000

PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.
LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times.
CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met.
CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page.
SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.
ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts.
SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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