Low Drop Voltage Regulators: SMS2954ACM-5V 250mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V TO252 AMS Advanced Monolithic Systems AMS2954ACM-5V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Low Drop Voltage Regulators: SMS2954ACM-5V 250mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V TO252 AMS Advanced Monolithic Systems AMS2954ACM-5V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. TO252 AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V,SMS2954ACM-5V,250mA Low Drop Voltage Regulators,,Low Drop Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire Low Drop Voltage Regulators: SMS2954ACM-5V 250mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V TO252 AMS Advanced Monolithic Systems AMS2954ACM-5V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Low Drop Voltage Regulators: SMS2954ACM-5V 250mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V TO252 AMS Advanced Monolithic Systems AMS2954ACM-5V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. TO252 AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V,SMS2954ACM-5V,250mA Low Drop Voltage Regulators,,Low Drop Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMS2954ACM-5V - FLIP CHIP GOLD CHIP TECHNOLOGY™ 250mA LOW DROPOUT VOLTAGE REGULATOR FEATURES APPLICATIONS 250mA Low Drop Voltage Regulators - FLIP CHIP High Accuracy Output Voltage 2.5V, 3.0V, 3.3V and 5.0V Versions Extremely Low Quiescent Current, Low Dropout Voltage Extremely Tight Load and Line Regulation Very Low Temperature Coefficient Current and Thermal Limiting Needs Minimum Capacitance (1?F) for Stability Unregulated DC Positive Transients 60V 1.24V to 29V Programmable Output Error Flag Warning of Voltage Output Dropout Logic Controlled Electronic Shutdown High reliability Unique new design in 0805 style case Gold metallization RoHS compliant, Lead Free Compatible with both chip and wire, flip chip and surface mount assembly. Battery Powered Systems Portable Consumer Equipment Cordless Telephones Portable (Notebook) Computers Portable Instrumentation Radio Control Systems Automotive Electronics Avionics Low-Power Voltage Reference Chip on Board System in package SIP Hybrid Circuits SMS2954ACM-5V AMS2954ACM-5V 250mA LOW DROPOUT VOLTAGE REGULATOR 250mA LOW DROPOUT VOLTAGE REGULATOR - PRODUCT DESCRIPTION SMS2954 are micro power voltage regulators with very low quiescent current (typ. 75?A), and very low dropout voltage (typ.50mV at light loads and 380mV at 250mA), ideally suited for use in battery-powered systems. The quiescent current increases only slightly at dropout, thus prolonging battery life. The SMS2954 series has positive transient protection up to 60V and can survive unregulated input transient up to 20V below ground. Featuring a tight initial tolerance (typ. 0.5%), excellent load and line regulation (typ. 0.05%), and a very low output voltage temperature coefficient, the SMS2954 can be used as a low-power voltage reference. The SMS2954 is available in the 3L TO-220 package, 3L TO-263, SOT-223, TO-252 and in 8-pin plastic SOIC and DIP packages. In the 8L SOIC and PDIP packages the following additional features are offered: an error flag output warns of a low output voltage, often due to failing batteries on input; the logic-compatible shutdown input enables the regulator to be switched on and off; the device may be pin-strapped for a 2.5V, 3.0V, 3.3V or 5.0V output, or programmed from 1.24V to 29V with an external pair of resistors. Flip Chip Low Drop Voltage Regulators Integrated Circuits series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated) Parameter Symbol Value Unit Power Dissipation Internally limited Input Voltage -0.3 to +30 V Operating Voltage Range 40 V FEEDBACK Input Voltage -1.5 to +30 V Storage Temperature -65 to +150 °C Operating Junction Temperature -40 to +125 °C Electrical Characteristics at Vs=Vout+1V, Ta=25°C, unless otherwise noted. Name Symbol Test Conditions Value Unit Min. Typ. Max Output Voltage TJ=25°C (Note 3) 4.975 5 5.025 V Output Voltage -25°C≤TJ≤85°C 4.95 5 5.05 V Output Voltage, over the full operating temperature range. Full Operating Temperature Range 4.94 5 5.06 V Output Voltage 100 µA≤IL≤250mA,TJ≤TJMAX 4.925 5 5.075 V Line Regulation 6V≤Vin≤30V (Note 15) 0.03 0.1 % Load Regulation 100 µA≤IL≤250 mA 0.04 0.16 % Dropout Voltage (VIN - VOUT) IL=100µ A 50 80 mV Dropout Voltage (VIN - VOUT) IL=250 mA 380 600 mV Current Limit Vout=0 200 500 mA Output Voltage TC (VOUT TC) (Note 12) (Note 4) 20 100 ppm/°C Ground Pin Current IL=100 µA 75 120 m A Ground Pin Current IL=250 mA 15 20 mA Output Noise Voltage 10Hz to 100KHz,CL=1µF 430 µV rms Output Noise Voltage 10Hz to 100KHz,CL=200 µF 160 µV rms Output Noise Voltage 10Hz to 100KHz,CL=13.3 µF 100 µV rms Thermal Regulation (Note 13) 0.05 0.2 %/W Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: Unless otherwise specified all limits guaranteed for VIN = ( VONOM +1)V, IL = 100 µA and CL = 1 µF for 5V versions and 2.2µF for 3V and 3.3V versions. Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for TA = TJ = 25°C Additional conditions for the 8-pin versions are FEEDBACK tied to VTAP, OUTPUT tied to SENSE and VSHUTDOWN ≤ 0.8V. Note 3: Guaranteed and 100% production tested. Note 4: Guaranteed but not 100% production tested. These limits are not used to calculate outgoing AQL levels. Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 100 mV below its nominal value measured at 1V differential. At very low values of programmed output voltage, the minimum input supply voltage of 2V ( 2.3V over temperature) must be taken into account. Note 6: Comparator thresholds are expressed in terms of a voltage differential at the feedback terminal below the nominal reference voltage measured at VIN = ( VONOM +1)V. To express these thresholds in terms of output voltage change, multiply by the error amplifier gain = Vout/Vref = (R1 + R2)/R2. For example, at a programmed output voltage of 5V, the error output is guaranteed to go low when the output drops by 95 mV x 5V/1.235 = 384 mV. Thresholds remain constant as a percent of Vout as Vout is varied, with the dropout warning occurring at typically 5% below nominal, 7.5% guaranteed. Note 7: Vref ≤Vout ≤ (Vin - 1V), 2.3 ≤Vin≤30V, 100µA≤IL≤ 100 mA, TJ ≤ TJMAX. Note 8: The junction-to-ambient thermal resistance are as follows:180°C/W and 160°C/W for the TO-92 (N) package with 0.40 inch and 0.25 inch leads to the printed circuit board (PCB) respectively, 105°C/W for the molded plastic DIP (P) and 160°C/W for the molded plastic SO-8 (S). The above thermal resistances for the N, S and P packages apply when the package is soldered directly to the PCB. Note 9: May exceed input supply voltage. Note 10: When used in dual-supply systems where the output terminal sees loads returned to a negative supply, the output voltage should be diode-clamped to ground. Note 11: Vshutdown ≥ 2V, Vin ≤ 30V, Vout =0, Feedback pin tied to 5VTAP. Note 12: Output or reference voltage temperature coefficients defined as the worst case voltage change divided by the total temperature range. Note 13: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 50mA load pulse at VIN =30V (1.25W pulse) for T =10 ms. Note 14: Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specification for thermal regulation. Note 15: Line regulation for the LP2951 is tested at 150°C for IL = 1 mA. For IL = 100 µA and TJ = 125°C, line regulation is guaranteed by design to 0.2%. See typical performance characteristics for line regulation versus temperature and load current. Note 16: All LP2950 devices have the nominal output voltage coded as the last two digits of the part number. In the LP2951 products, the 3.0V and 3.3V versions are designated by the last two digits, but the 5V version is denoted with no code of the part number. SPICE MODEL AMS2954ACM-5V spice model pending. CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V GENERAL DIE INFORMATION Substrate Thickness [mils] Size LxW[mils] Bonding pads dimensions per drawing Backside Silicon Si 10±2 81x45±1 [2.05x1.15±0.025] Type Pad metal Thickness Assembly -FC TiW/Au 4µm±1 Wire bonding or Silver epoxy -GB TiW/Au 25µm±2.5 Thermosonic -GT Ti/Pt/AuSn 5µm±1 Reflow -AN Ni/Au 5µm±1 Solder reflow Optional backside coating and/or marking. LAYOUT / DIMENSIONS / PAD LOCATIONS Click to select process: -FC -GB -GT -AN SMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V 250mA LOW DROPOUT VOLTAGE REGULATOR SMS2954ACM-5V AMS2954ACM-5V 250mA LOW DROPOUT VOLTAGE REGULATOR wire bonding SMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V 250mA LOW DROPOUT VOLTAGE REGULATORthermosonic SMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V 250mA LOW DROPOUT VOLTAGE REGULATORthermal SMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V 250mA LOW DROPOUT VOLTAGE REGULATORsolder reflow SMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V 250mA LOW DROPOUT VOLTAGE REGULATOR APPLICATION HINTS APPLICATION HINTS External Capacitors A 1.0µF or greater capacitor is required between output and ground for stability at output voltages of 5V or more. At lower output voltages, more capacitance is required (2.2µ or more is recommended for 2.5V, 3.0V and 3.3V versions). Without this capacitor the part will oscillate. Most types of tantalum or aluminum electrolytic works fine here; even film types work but are not recommended for reasons of cost. Many aluminum types have electrolytes that freeze at about -30°C, so solid tantalums are recommended for operation below -25°C. The important parameters of the capacitor are an ESR of about 5Ω or less and resonant frequency above 500 kHz parameters in the value of the capacitor. The value of this capacitor may be increased without limit. At lower values of output current, less output capacitance is required for stability. The capacitor can be reduced to 0.33µF for currents below 10 mA or 0.1µF for currents below 1 mA. Using the adjustable versions at voltages below 5V runs the error amplifier at lower gains so that more output capacitance is needed. For the worst-case situation of a 300mA load at 1.23V output (Output shorted to Feedback) a 3.3µF (or greater) capacitor should be used. Unlike many other regulators, the SMS2954, will remain stable and in regulation with no load in addition to the internal voltage divider. This is especially important in CMOS RAM keep-alive applications. When setting the output voltage of the SMS2954 version with external resistors, a minimum load of 1µA is recommended. A 1µF tantalum or aluminum electrolytic capacitor should be placed from the SMS2954/SMS2954 input to the ground if there is more than 10 inches of wire between the input and the AC filter capacitor or if a battery is used as the input. Stray capacitance to the SMS2954 Feedback terminal can cause instability. This may especially be a problem when using a higher value of external resistors to set the output voltage. Adding a 100 pF capacitor between Output and Feedback and increasing the output capacitor to at least 3.3µF will fix this problem. Error Detection Comparator Output The comparator produces a logic low output whenever the SMS2954 output falls out of regulation by more than approximately 5%. This figure is the comparator's built-in offset of about 60 mV divided by the 1.235 reference voltage (Refer to the block diagram). This trip level remains "5% below normal" regardless of the programmed output voltage of the 2951. For example, the error flag trip level is typically 4.75V for a 5V output or 11.4V for a 12V output. The out of regulation condition may be due either to low input voltage, current limiting, or thermal limiting. Figure 2 gives a timing diagram depicting the ERROR signal and the regulator output voltage as the SMS2954 input is ramped up and down. For 5V versions the ERROR signal becomes valid (low) at about 1.3V input. It goes high at about 5V input (the input voltage at which Vout = 4.75 ). Since the SMS2954's dropout voltage is load dependent (see curve in typical performance characteristics), the input voltage trip point (about 5V) will vary with the load current. The output voltage trip point (approx. 4.75V) does not vary with load. The error comparator has an open-collector output which requires an external pull-up resistor. This resistor may be returned to the output or some other supply voltage depending on system requirements. In determining a value for this resistor, note that the output is rated to sink 400?A, this sink current adds to battery drain in a low battery condition. Suggested values range from 100K to 1MΩ. The resistor is not required if this output is unused. When VIN≤1.3V the error flag pin becomes a high impedance, and the error flag voltage rises to its pull-up voltage. Using Vout as the pull-up voltage (see Figure 1), rather than an external 5V source, will keep the error flag voltage under 1.2V (typ.) in this condition. The user may wish to drive down the error flag voltage using equal value resistors (10K suggested), to ensure a low-level logic signal during any fault condition, while still allowing a valid high logic level during normal operation. Programming the Output Voltage The SMS2954 may be pin-strapped for the nominal fixed output voltage using its internal voltage divider by tying the output and sense pins together, and also tying the feedback and VTAP pins together. Alternatively, it may be programmed for any output voltage between its 1.235V reference and its 30V maximum rating. As seen in Figure 1, an external pair of resistors is required. The complete equation for the output voltage is: Vout = VREF (1 + R1/ R2)+ IFBR1 where VREF is the nominal 1.235 reference voltage and IFB is the feedback pin bias current, nominally -20 nA. The minimum recommended load current of 1µA forces an upper limit of 1.2MΩ on value of R2, if the regulator must work with no load (a condition often found in CMOS in standby) IFB will produce a 2% typical error in VOUT which may be eliminated at room temperature by trimming R1. For better accuracy, choosing R2 = 100k reduces this error to 0.17% while increasing the resistor program current by 12 ?A. Since the SMS2954 typically draws 60µA at no load with Pin 2 open-circuited, this is a small price to pay. Reducing Output Noise In reference applications it may be an advantageous to reduce the AC noise present at the output. One method is to reduce the regulator bandwidth by increasing the size of the output capacitor. This is the only way that noise can be reduced on the 3 lead SMS2954 but is relatively inefficient, as increasing the capacitor from 1 ?F to 220 ?F only decreases the noise from 430 µV to 160µV rms for a 100 kHz bandwidth at 5V output. Noise could also be reduced fourfold by a bypass capacitor across R1, since it reduces the high frequency gain from 4 to unity. Pick CBYPASS =1/(2piR1) 200 Hz or about 0.01µF. When doing this, the output capacitor must be increased to 3.3µF to maintain stability. These changes reduce the output noise from 430µV to 100µV rms for a 100 kHz bandwidth at 5V output. With the bypass capacitor added, noise no longer scales with output voltage so that improvements are more dramatic at higher output voltages. Heatsink Requirements A heatsink might be required when using SMS2954, depending on the maximum power dissipation and maximum ambient temperature of the application. The heatsink must be chosen considering that under all operating condition, the junction temperature must be within the range specified under Absolute Maximum Ratings. To determine if a heatsink is required, the maximum power dissipated by the regulator must be calculated. It is important to consider, that if the regulator is powered from a transformer connected to the AC line, the maximum specified AC input voltage must be used. The next parameter which must be calculated is the maximum allowable temperature rise, TR(max). This is calculated using the formula: TR(max)=TJ(max)-TA(max) Where TJ(max) is the maximum allowable junction temperature, and TA(max) is the maximum ambient temperature. Using the calculated values for TR(max) and P(max), the required value for junction to ambient thermal resistance Rth(J-A), can be determined: Rth(J-A)=TR(max)/P(max) If the value obtained is 60°C/W or higher, the regulator may be operated without an external heatsink. If the calculated value is below 60°C/W, an external heatsink is required. To calculate the thermal resistance of this heatsink use the formula: Rth(H-A) = Rth(J-A) - Rth(J-C) - Rth(C-H) where: Rth(J-C) is the junction-to-case thermal resistance, which is specified as 3°C/W maximum for the SMS2954. Rth(C-H) is the case-to-heatsink thermal resistance, which is dependent on the interfacing material (if used). Rth(H-A) is the heatsink-to-ambient thermal resistance. It is this specification which defines the effectiveness of the heatsink. The heatsink selected must have a thermal resistance equal or lower than the value of Rth(H-A) calculated from the above listed formula. Output Isolation The regulator output can be left connected to an active voltage source with the regulator input power turned off, as long as the regulator ground pin is connected to ground. If the ground pin is left floating, damage to the regulator can occur if the output is pulled up by an external voltage source. Adjustable Regulator Figure 1: Adjustable Regulator ERROR Output Timing Figure 2: ERROR Output Timing Wide Input Voltage Range Current Limiter Figure 3: Wide Input Voltage Range Current Limiter Low Drift Current Source Figure 4: Low Drift Current Source 5V Regulator with 2.5V Sleep Function Figure 5: 5V Regulator with 2.5V Sleep Function 2A Low Dropout Regulator Figure 6: 2A Low Dropout Regulator Latch Off When Error Flag Occurs Figure 7: Latch Off When Error Flag Occurs SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. Semiconix Flip Chip -FC series can be also used for thermosonic wire bonding. Semiconix Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. Semiconix Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process. Semiconix -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications. Semiconix Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc. Semiconix Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages. STANDARD PRODUCTS ORDERING INFORMATION VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($) Flip chip SMS2954ACM-5V-FC -WP 1000 -FF 1000 Flip chip SMS2954ACM-5V-FC -WP 5000 -FF 5000 Gold Bump SMS2954ACM-5V-GB -WP 1000 -FF 1000 Gold Bump SMS2954ACM-5V-GB -WP 5000 -FF 5000 Gold-Tin SMS2954ACM-5V-GT -WP 1000 -FF 1000 Gold-Tin SMS2954ACM-5V-GT -WP 5000 -FF 5000 Gold/Nickel SMS2954ACM-5V-AN -WP 1000 -FF 1000 Gold/Nickel SMS2954ACM-5V-AN -WP 5000 -FF 5000 PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice. LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated:January 01, 1970 Display settings for best viewing: Current display settings: Page hits: 1 Screen resolution: 1124x864 Screen resolution: Total site visits: 1 Color quality: 16 bit Color quality: bit 1990-2009 SEMICONIX SEMICONDUCTOR All rights reserved. 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semiconix semiconductor - where the future is today - gold chip technology SMS2954ACM-5V - FLIP CHIP
GOLD CHIP TECHNOLOGY™ 250mA LOW DROPOUT VOLTAGE REGULATOR

FEATURES APPLICATIONS 250mA Low Drop Voltage Regulators - FLIP CHIP
High Accuracy Output Voltage 2.5V, 3.0V, 3.3V and 5.0V Versions
Extremely Low Quiescent Current, Low Dropout Voltage
Extremely Tight Load and Line Regulation
Very Low Temperature Coefficient
Current and Thermal Limiting
Needs Minimum Capacitance (1?F) for Stability
Unregulated DC Positive Transients 60V
1.24V to 29V Programmable Output
Error Flag Warning of Voltage Output Dropout
Logic Controlled Electronic Shutdown
High reliability
Unique new design in 0805 style case
Gold metallization
RoHS compliant, Lead Free
Compatible with both chip and wire, flip chip and surface mount assembly.
Battery Powered Systems
Portable Consumer Equipment
Cordless Telephones
Portable (Notebook) Computers
Portable Instrumentation
Radio Control Systems
Automotive Electronics
Avionics
Low-Power Voltage Reference
Chip on Board
System in package SIP
Hybrid Circuits
SMS2954ACM-5V AMS2954ACM-5V 250mA LOW DROPOUT VOLTAGE REGULATOR

250mA LOW DROPOUT VOLTAGE REGULATOR - PRODUCT DESCRIPTION
SMS2954 are micro power voltage regulators with very low quiescent current (typ. 75?A), and very low dropout voltage (typ.50mV at light loads and 380mV at 250mA), ideally suited for use in battery-powered systems. The quiescent current increases only slightly at dropout, thus prolonging battery life. The SMS2954 series has positive transient protection up to 60V and can survive unregulated input transient up to 20V below ground. Featuring a tight initial tolerance (typ. 0.5%), excellent load and line regulation (typ. 0.05%), and a very low output voltage temperature coefficient, the SMS2954 can be used as a low-power voltage reference. The SMS2954 is available in the 3L TO-220 package, 3L TO-263, SOT-223, TO-252 and in 8-pin plastic SOIC and DIP packages. In the 8L SOIC and PDIP packages the following additional features are offered: an error flag output warns of a low output voltage, often due to failing batteries on input; the logic-compatible shutdown input enables the regulator to be switched on and off; the device may be pin-strapped for a 2.5V, 3.0V, 3.3V or 5.0V output, or programmed from 1.24V to 29V with an external pair of resistors.
Flip Chip Low Drop Voltage Regulators Integrated Circuits series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS
Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions.

ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated)
Parameter Symbol Value Unit
Power Dissipation Internally limited
Input Voltage -0.3 to +30 V
Operating Voltage Range 40 V
FEEDBACK Input Voltage -1.5 to +30 V
Storage Temperature -65 to +150 °C
Operating Junction Temperature -40 to +125 °C

Electrical Characteristics at Vs=Vout+1V, Ta=25°C, unless otherwise noted.
Name Symbol Test Conditions Value Unit
Min. Typ. Max
Output Voltage TJ=25°C (Note 3) 4.975 5 5.025 V
Output Voltage -25°C≤TJ≤85°C 4.95 5 5.05 V
Output Voltage, over the full operating temperature range. Full Operating Temperature Range 4.94 5 5.06 V
Output Voltage 100 µA≤IL≤250mA,TJ≤TJMAX 4.925 5 5.075 V
Line Regulation 6V≤Vin≤30V (Note 15) 0.03 0.1 %
Load Regulation 100 µA≤IL≤250 mA 0.04 0.16 %
Dropout Voltage (VIN - VOUT) IL=100µ A 50 80 mV
Dropout Voltage (VIN - VOUT) IL=250 mA 380 600 mV
Current Limit Vout=0 200 500 mA
Output Voltage TC (VOUT TC) (Note 12) (Note 4) 20 100 ppm/°C
Ground Pin Current IL=100 µA 75 120 m A
Ground Pin Current IL=250 mA 15 20 mA
Output Noise Voltage 10Hz to 100KHz,CL=1µF 430 µV rms
Output Noise Voltage 10Hz to 100KHz,CL=200 µF 160 µV rms
Output Noise Voltage 10Hz to 100KHz,CL=13.3 µF 100 µV rms
Thermal Regulation (Note 13) 0.05 0.2 %/W
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2: Unless otherwise specified all limits guaranteed for VIN = ( VONOM +1)V, IL = 100 µA and CL = 1 µF for 5V versions and 2.2µF for 3V and 3.3V
versions. Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for TA = TJ =
25°C Additional conditions for the 8-pin versions are FEEDBACK tied to VTAP, OUTPUT tied to SENSE and VSHUTDOWN ≤ 0.8V.
Note 3: Guaranteed and 100% production tested.
Note 4: Guaranteed but not 100% production tested. These limits are not used to calculate outgoing AQL levels.
Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 100 mV below its nominal value measured at 1V
differential. At very low values of programmed output voltage, the minimum input supply voltage of 2V ( 2.3V over temperature) must be taken into account.
Note 6: Comparator thresholds are expressed in terms of a voltage differential at the feedback terminal below the nominal reference voltage measured at
VIN = ( VONOM +1)V. To express these thresholds in terms of output voltage change, multiply by the error amplifier gain = Vout/Vref = (R1 + R2)/R2. For
example, at a programmed output voltage of 5V, the error output is guaranteed to go low when the output drops by 95 mV x 5V/1.235 = 384 mV. Thresholds
remain constant as a percent of Vout as Vout is varied, with the dropout warning occurring at typically 5% below nominal, 7.5% guaranteed.
Note 7: Vref ≤Vout ≤ (Vin - 1V), 2.3 ≤Vin≤30V, 100µA≤IL≤ 100 mA, TJ ≤ TJMAX.
Note 8: The junction-to-ambient thermal resistance are as follows:180°C/W and 160°C/W for the TO-92 (N) package with 0.40 inch and 0.25 inch leads to the
printed circuit board (PCB) respectively, 105°C/W for the molded plastic DIP (P) and 160°C/W for the molded plastic SO-8 (S). The above thermal resistances
for the N, S and P packages apply when the package is soldered directly to the PCB.
Note 9: May exceed input supply voltage.
Note 10: When used in dual-supply systems where the output terminal sees loads returned to a negative supply, the output voltage should be diode-clamped to
ground.
Note 11: Vshutdown ≥ 2V, Vin ≤ 30V, Vout =0, Feedback pin tied to 5VTAP.
Note 12: Output or reference voltage temperature coefficients defined as the worst case voltage change divided by the total temperature range.
Note 13: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line
regulation effects. Specifications are for a 50mA load pulse at VIN =30V (1.25W pulse) for T =10 ms.
Note 14: Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects
are covered under the specification for thermal regulation.
Note 15: Line regulation for the LP2951 is tested at 150°C for IL = 1 mA. For IL = 100 µA and TJ = 125°C, line regulation is guaranteed by design to 0.2%. See
typical performance characteristics for line regulation versus temperature and load current.
Note 16: All LP2950 devices have the nominal output voltage coded as the last two digits of the part number. In the LP2951 products, the 3.0V and 3.3V
versions are designated by the last two digits, but the 5V version is denoted with no code of the part number.
SPICE MODEL
Spice model pending.
CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Size
LxW[mils]
Bonding pads dimensions per drawing Backside
Silicon
Si
10±2 81x45±1
[2.05x1.15±0.025]
TypePad metalThicknessAssembly
-FCTiW/Au4µm±1Wire bonding or Silver epoxy
-GBTiW/Au25µm±2.5Thermosonic
-GTTi/Pt/AuSn5µm±1Reflow
-ANNi/Au5µm±1Solder reflow
Optional backside coating and/or marking.

LAYOUT / DIMENSIONS / PAD LOCATIONS
Click to select process: -FC -GB -GT -AN
SMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V 250mA LOW DROPOUT VOLTAGE REGULATOR SMS2954ACM-5V AMS2954ACM-5V 250mA LOW DROPOUT VOLTAGE REGULATOR
wire bonding SMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V, AMS Advanced Monolithic Systems AMS2954ACM-5V AMS Advanced Monolithic Systems AMS2954ACM-5V 250mA LOW DROPOUT VOLTAGE REGULATOR

APPLICATION HINTS

APPLICATION HINTS 


External Capacitors
A 1.0µF or greater capacitor is required between output and
ground for stability at output voltages of 5V or more. At lower output voltages, more capacitance is required (2.2µ or more is recommended for 2.5V, 3.0V and 3.3V versions). Without this capacitor the part will oscillate. Most types of tantalum or aluminum electrolytic works fine here; even film types work but are not recommended for reasons of cost. Many aluminum types have electrolytes that freeze at about -30°C, so solid tantalums are recommended for operation below -25°C. The important parameters of the capacitor are an ESR of about 5Ω or less and resonant frequency above 500 kHz parameters in the value of the capacitor. The value of this capacitor may be increased without limit.
At lower values of output current, less output capacitance is required for stability. The capacitor can be reduced to 0.33µF for currents below 10 mA or 0.1µF for currents below 1 mA. Using the adjustable versions at voltages below 5V runs the error amplifier at lower gains so that more output capacitance is needed.
For the worst-case situation of a 300mA load at 1.23V output (Output shorted to Feedback) a 3.3µF (or greater) capacitor should be used.
Unlike many other regulators, the SMS2954, will remain stable and in regulation with no load in addition to the internal voltage divider. This is especially important in CMOS RAM keep-alive applications. When setting the output voltage of the SMS2954 version with external resistors, a minimum load of 1µA is recommended.
A 1µF tantalum or aluminum electrolytic capacitor should be placed from the SMS2954/SMS2954 input to the ground if there is more than 10 inches of wire between the input and the AC filter capacitor or if a battery is used as the input.
Stray capacitance to the SMS2954 Feedback terminal can cause instability. This may especially be a problem when using a higher value of external resistors to set the output voltage. Adding a 100 pF capacitor between Output and Feedback and increasing the output capacitor to at least 3.3µF will fix this problem.

Error Detection Comparator Output
The comparator produces a logic low output whenever the SMS2954 output falls out of regulation by more than approximately 5%. This figure is the comparator's built-in offset of about 60 mV divided by the 1.235 reference voltage (Refer to the block diagram). This trip level remains "5% below normal" regardless of the programmed output voltage of the 2951. For example, the error flag trip level is typically 4.75V for a 5V output or 11.4V for a 12V output. The out of regulation condition may be due either to low input voltage, current limiting, or thermal limiting.
Figure 2 gives a timing diagram depicting the ERROR signal and the regulator output voltage as the SMS2954 input is ramped up and down. For 5V versions the ERROR signal becomes valid (low) at about 1.3V input. It goes high at about 5V input (the input voltage at which Vout = 4.75 ).
Since the SMS2954's dropout voltage is load dependent (see curve in typical performance characteristics), the input voltage trip point (about 5V) will vary with the load current. The output voltage trip point (approx. 4.75V) does not vary with load.
The error comparator has an open-collector output which requires an external pull-up resistor. This resistor may be returned to the output or some other supply voltage depending on system requirements. In determining a value for this resistor, note that the output is rated to sink 400?A, this sink current adds to battery drain in a low battery condition. Suggested values range from 100K to 1MΩ. The resistor is not required if this output is unused.
When VIN≤1.3V the error flag pin becomes a high impedance, and the error flag voltage rises to its pull-up voltage. Using Vout as the pull-up voltage (see Figure 1), rather than an external 5V source, will keep the error flag voltage under 1.2V (typ.) in this condition. The user may wish to drive down the error flag voltage using equal value resistors (10K suggested), to ensure a low-level logic signal during any fault condition, while still allowing a valid high logic level during normal operation.

Programming the Output Voltage
The SMS2954 may be pin-strapped for the nominal fixed output voltage using its internal voltage divider by tying the output and sense pins together, and also tying the feedback and VTAP pins together. Alternatively, it may be programmed for any output
voltage between its 1.235V reference and its 30V maximum rating. As seen in Figure 1, an external pair of resistors is required.
The complete equation for the output voltage is:
Vout = VREF (1 + R1/ R2)+ IFBR1
where VREF is the nominal 1.235 reference voltage and IFB is the feedback pin bias current, nominally -20 nA. The minimum recommended load current of 1µA forces an upper limit of 1.2MΩ on value of R2, if the regulator must work with no load (a
condition often found in CMOS in standby) IFB will produce a 2% typical error in VOUT which may be eliminated at room temperature by trimming R1. For better accuracy, choosing R2 = 100k reduces this error to 0.17% while increasing the resistor program current by 12 ?A. Since the SMS2954 typically draws 60µA at no load with Pin 2 open-circuited, this is a small price to pay.

Reducing Output Noise
In reference applications it may be an advantageous to reduce the AC noise present at the output. One method is to reduce the
regulator bandwidth by increasing the size of the output capacitor. This is the only way that noise can be reduced on the 3
lead SMS2954 but is relatively inefficient, as increasing the capacitor from 1 ?F to 220 ?F only decreases the noise from 430
µV to 160µV rms for a 100 kHz bandwidth at 5V output. Noise could also be reduced fourfold by a bypass capacitor across
R1, since it reduces the high frequency gain from 4 to unity. Pick
CBYPASS =1/(2piR1) 200 Hz
or about 0.01µF. When doing this, the output capacitor must be increased to 3.3µF to maintain stability. These changes reduce the output noise from 430µV to 100µV rms for a 100 kHz bandwidth at 5V output. With the bypass capacitor added, noise no longer scales with output voltage so that improvements are more dramatic at higher output voltages.

Heatsink Requirements
A heatsink might be required when using SMS2954, depending on the maximum power dissipation and maximum ambient temperature of the application. The heatsink must be chosen considering that under all operating condition, the junction temperature must be within the range specified under Absolute Maximum Ratings. To determine if a heatsink is required, the maximum power dissipated by the regulator must be calculated. It is important to consider, that if the regulator is powered from a transformer connected to the AC line, the maximum specified AC input voltage must be used.
The next parameter which must be calculated is the maximum allowable temperature rise, TR(max). This is calculated using the formula:
TR(max)=TJ(max)-TA(max)
Where TJ(max) is the maximum allowable junction temperature, and TA(max) is the maximum ambient temperature.
Using the calculated values for TR(max) and P(max), the required value for junction to ambient thermal resistance Rth(J-A), can be determined:
Rth(J-A)=TR(max)/P(max)
If the value obtained is 60°C/W or higher, the regulator may be operated without an external heatsink. If the calculated value is below 60°C/W, an external heatsink is required. To calculate the thermal resistance of this heatsink use the formula:
Rth(H-A) = Rth(J-A) - Rth(J-C) - Rth(C-H)
where:
Rth(J-C) is the junction-to-case thermal resistance, which is specified as 3°C/W maximum for the SMS2954.
Rth(C-H) is the case-to-heatsink thermal resistance, which is dependent on the interfacing material (if used).
Rth(H-A) is the heatsink-to-ambient thermal resistance. It is this specification which defines the effectiveness of the heatsink. The heatsink selected must have a thermal resistance equal or lower than the
value of Rth(H-A) calculated from the above listed formula.

Output Isolation
The regulator output can be left connected to an active voltage source with the regulator input power turned off, as long as the regulator ground pin is connected to ground. If the ground pin is left floating, damage to the regulator can occur if the output is pulled up by an external voltage source.
Adjustable Regulator
Figure 1: Adjustable Regulator
ERROR Output Timing
Figure 2: ERROR Output Timing
Wide Input Voltage Range Current Limiter
Figure 3: Wide Input Voltage Range Current Limiter
Low Drift Current Source
Figure 4: Low Drift Current Source
5V Regulator with 2.5V Sleep Function
Figure 5: 5V Regulator with 2.5V Sleep Function
2A Low Dropout Regulator
Figure 6: 2A Low Dropout Regulator
Latch Off When Error Flag Occurs
Figure 7: Latch Off When Error Flag Occurs

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
Semiconix flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. Semiconix Flip Chip -FC series can be also used for thermosonic wire bonding. Semiconix Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. Semiconix Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process.
Semiconix -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications.
Semiconix Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc.
Semiconix Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages.

STANDARD PRODUCTS ORDERING INFORMATION

VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($)
Flip chip SMS2954ACM-5V-FC -WP 1000 -FF 1000
Flip chip SMS2954ACM-5V-FC -WP 5000 -FF 5000
Gold Bump SMS2954ACM-5V-GB -WP 1000 -FF 1000
Gold Bump SMS2954ACM-5V-GB -WP 5000 -FF 5000
Gold-Tin SMS2954ACM-5V-GT -WP 1000 -FF 1000
Gold-Tin SMS2954ACM-5V-GT -WP 5000 -FF 5000
Gold/Nickel SMS2954ACM-5V-AN -WP 1000 -FF 1000
Gold/Nickel SMS2954ACM-5V-AN -WP 5000 -FF 5000

PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.
LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times.
CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met.
CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page.
SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.
ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts.
SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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