SMX LM324 Low Power Quad Operational Amplifiers same as Texas Instruments LM324, BayLinear LM324, Fairchild Semiconductor LM324A, Fairchild Semiconductor LM324N, Fairchild Semiconductor LM324AMX, Fairchild Semiconductor LM324AN, Fairchild Semiconductor LM324MX, Fairchild Semiconductor LM324AM, Fairchild Semiconductor LM324M, Fairchild Semiconductor LM324, Intersil LM324, Intersil LM324N, Motorola LM324AD, Motorola LM324, Motorola LM324AN, Motorola LM324A, Motorola LM324N, Motorola LM324D, National Semiconductor LM324N, National Semiconductor LM324AMX, National Semiconductor LM324AN, National Semiconductor LM324AM, National Semiconductor LM324MX, National Semiconductor LM324M, National Semiconductor LM324 MDA, National Semiconductor LM324 MWA, National Semiconductor LM324J, National Semiconductor LM324, National Semiconductor LM324MT, National Semiconductor LM324MTX, ON Semiconductor LM324DT, ON Semiconductor LM324AN, ON Semiconductor LM324DTBR2, ON Semiconductor LM324DTB, ON Semiconductor LM324DR2, ON Semiconductor LM324-D, ON Semiconductor LM324ADTBR2, ON Semiconductor LM324ADTB, ON Semiconductor LM324AD, ON Semiconductor LM324A, ON Semiconductor LM324, ON Semiconductor LM324N, ON Semiconductor LM324ADR2, ON Semiconductor LM324D, Philips LM324D, Philips LM324F, Philips LM324, Philips LM324A, Philips LM324AD, Philips LM324N, Philips LM324AN, SGS Thomson Microelectronics LM324, SGS Thomson Microelectronics LM324ADT, SGS Thomson Microelectronics LM324DT, SGS Thomson Microelectronics LM324AD, SGS Thomson Microelectronics LM324A, SGS Thomson Microelectronics LM324D, ST Microelectronics LM324DT, ST Microelectronics LM324N, ST Microelectronics LM324W, ST Microelectronics LM324WN, ST Microelectronics LM324WDT, ST Microelectronics LM324WD, ST Microelectronics LM324PT, ST Microelectronics LM324WPT, ST Microelectronics LM324AN, ST Microelectronics LM324ADT, ST Microelectronics LM324AP, ST Microelectronics LM324APT, ST Microelectronics LM324AD, ST Microelectronics LM324, ST Microelectronics LM324A, ST Microelectronics LM224A-LM324A, ST Microelectronics LM324D, ST Microelectronics LM324P, ST Microelectronics LM224-LM324, Texas Instruments LM324YDB, Texas Instruments LM324ADR, Texas Instruments LM324YN, Texas Instruments LM324ADBR, Texas Instruments LM324ADBLE, Texas Instruments LM324ADB, Texas Instruments LM324AD, Texas Instruments LM324PW, Texas Instruments LM324N, Texas Instruments LM324, Texas Instruments LM324Y, Texas Instruments LM324PWR, Texas Instruments LM324PWLE, Texas Instruments LM324YD, Texas Instruments LM324A, Texas Instruments LM324D, Texas Instruments LM324NSR, Texas Instruments LM324YPW, Texas Instruments LM324AN, Texas Instruments LM324KAN, Texas Instruments LM324KADR, Texas Instruments LM324KAD, Texas Instruments LM324KA, Texas Instruments LM324K, Texas Instruments LM324APW, Texas Instruments LM324APWLE, Texas Instruments LM324APWR, Texas Instruments LM324DB, Texas Instruments LM324DBLE, Texas Instruments LM324KANS, Texas Instruments LM324KANSR, Texas Instruments LM324KAPW, Texas Instruments LM324ANSR, Texas Instruments LM324AP, Texas Instruments LM324KPWR, Texas Instruments LM324KPW, Texas Instruments LM324KNSR, Texas Instruments LM324KNS, Texas Instruments LM324KN, Texas Instruments LM324KDR, Texas Instruments LM324KD, Texas Instruments LM324KAPWR, Texas Instruments LM324DR manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. BayLinear LM324, Fairchild Semiconductor LM324, Intersil LM324, Motorola LM324, National Semiconductor LM324, ON Semiconductor LM324, Philips LM324, SGS Thomson Microelectronics LM324, ST Microelectronics LM224A-LM324A, Texas Instruments LM324 SMX LM324 Low Power Quad Operational Amplifiers same as Texas Instruments LM324, BayLinear LM324, Fairchild Semiconductor LM324A, Fairchild Semiconductor LM324N, Fairchild Semiconductor LM324AMX, Fairchild Semiconductor LM324AN, Fairchild Semiconductor LM324MX, Fairchild Semiconductor LM324AM, Fairchild Semiconductor LM324M, Fairchild Semiconductor LM324, Intersil LM324, Intersil LM324N, Motorola LM324AD, Motorola LM324, Motorola LM324AN, Motorola LM324A, Motorola LM324N, Motorola LM324D, National Semiconductor LM324N, National Semiconductor LM324AMX, National Semiconductor LM324AN, National Semiconductor LM324AM, National Semiconductor LM324MX, National Semiconductor LM324M, National Semiconductor LM324 MDA, National Semiconductor LM324 MWA, National Semiconductor LM324J, National Semiconductor LM324, National Semiconductor LM324MT, National Semiconductor LM324MTX, ON Semiconductor LM324DT, ON Semiconductor LM324AN, ON Semiconductor LM324DTBR2, ON Semiconductor LM324DTB, ON Semiconductor LM324DR2, ON Semiconductor LM324-D, ON Semiconductor LM324ADTBR2, ON Semiconductor LM324ADTB, ON Semiconductor LM324AD, ON Semiconductor LM324A, ON Semiconductor LM324, ON Semiconductor LM324N, ON Semiconductor LM324ADR2, ON Semiconductor LM324D, Philips LM324D, Philips LM324F, Philips LM324, Philips LM324A, Philips LM324AD, Philips LM324N, Philips LM324AN, SGS Thomson Microelectronics LM324, SGS Thomson Microelectronics LM324ADT, SGS Thomson Microelectronics LM324DT, SGS Thomson Microelectronics LM324AD, SGS Thomson Microelectronics LM324A, SGS Thomson Microelectronics LM324D, ST Microelectronics LM324DT, ST Microelectronics LM324N, ST Microelectronics LM324W, ST Microelectronics LM324WN, ST Microelectronics LM324WDT, ST Microelectronics LM324WD, ST Microelectronics LM324PT, ST Microelectronics LM324WPT, ST Microelectronics LM324AN, ST Microelectronics LM324ADT, ST Microelectronics LM324AP, ST Microelectronics LM324APT, ST Microelectronics LM324AD, ST Microelectronics LM324, ST Microelectronics LM324A, ST Microelectronics LM224A-LM324A, ST Microelectronics LM324D, ST Microelectronics LM324P, ST Microelectronics LM224-LM324, Texas Instruments LM324YDB, Texas Instruments LM324ADR, Texas Instruments LM324YN, Texas Instruments LM324ADBR, Texas Instruments LM324ADBLE, Texas Instruments LM324ADB, Texas Instruments LM324AD, Texas Instruments LM324PW, Texas Instruments LM324N, Texas Instruments LM324, Texas Instruments LM324Y, Texas Instruments LM324PWR, Texas Instruments LM324PWLE, Texas Instruments LM324YD, Texas Instruments LM324A, Texas Instruments LM324D, Texas Instruments LM324NSR, Texas Instruments LM324YPW, Texas Instruments LM324AN, Texas Instruments LM324KAN, Texas Instruments LM324KADR, Texas Instruments LM324KAD, Texas Instruments LM324KA, Texas Instruments LM324K, Texas Instruments LM324APW, Texas Instruments LM324APWLE, Texas Instruments LM324APWR, Texas Instruments LM324DB, Texas Instruments LM324DBLE, Texas Instruments LM324KANS, Texas Instruments LM324KANSR, Texas Instruments LM324KAPW, Texas Instruments LM324ANSR, Texas Instruments LM324AP, Texas Instruments LM324KPWR, Texas Instruments LM324KPW, Texas Instruments LM324KNSR, Texas Instruments LM324KNS, Texas Instruments LM324KN, Texas Instruments LM324KDR, Texas Instruments LM324KD, Texas Instruments LM324KAPWR, Texas Instruments LM324DR manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. BayLinear LM324, Fairchild Semiconductor LM324, Intersil LM324, Motorola LM324, National Semiconductor LM324, ON Semiconductor LM324, Philips LM324, SGS Thomson Microelectronics LM324, ST Microelectronics LM224A-LM324A, Texas Instruments LM324 REGISTER-LOGIN PRODUCTS CROSS REFERENCE /cgi-bin/stock.pl?part=LM324">INVENTORY /cgi-bin/rfq.cgi?site=4&rows=1&item_1=SMXLM324&c_item_1=">REQUEST QUOTE smxrootwww.semiconix.com/cgi-bin/order.cgi?site=">ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMX LM324 - BARE DIE GOLD CHIP TECHNOLOGY™ Low Power Quad Operational Amplifiers FEATURES APPLICATIONS Quad Operational Amplifiers Internally frequency compensated for unity gain Large DC voltage gain 100dB Wide bandwidth (unitygain) 1MHz Very low supply current drain (700µA) - essentially independent of supply voltage Low input biasing current 45 nA Low input offset voltage 2mV and offset current 5nA In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS LM324 LM324 Low Power Quad Operational Amplifiers SMXLM324 Low Power Quad Operational Amplifiers - PRODUCT DESCRIPTION The SMX LM324 series are low cost, quad operational amplifiers with true differential inputs. They have several distinct advantages over standard operational amplifier types in single supply applications. The quad amplifier can operate at supply voltages as low as 3.0 V or as high as 32 V with quiescent currents about one fifth of those associated with the MC1741 (on a per amplifier basis). The common mode input range includes the negative supply, thereby eliminating the necessity for external biasing components in many applications. The output voltage range also includes the negative power supply voltage. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 SEMICONDUCTOR INTEGRATED CIRCUITS MANUFACTURING PROCESS Semiconductor Integrated Circuits are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with other semiconductor devices on same chip to obtain standard and custom complex device solutions. SCHEMATIC DIAGRAM LM324 Texas Instruments LM324 Low Power Quad Operational Amplifiers LM324 MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNITS Power Supply Voltage Vdc Single Supply VCC 32 V Split Supplies VCC,VEE ±16 V Input Differential Voltage Range (Note 1) VDIR ±32 V Input Common Mode Voltage Range VICR -0.3 to 32 V Output Short Circuit Duration tSC Continuous Junction Temperature TJ 150 °C Storage Temperature Range Tstg -55 to +125 °C Operating Ambient Temperature Range TA 0 to +70 °C ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. LM324 ELECTRICAL CHARACTERISTICS TA=25°C unless otherwise specificed PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNITS Input Offset Voltage VCC=5.0V to 30V VICR=0V to VCC=1.7V VO=1.4V, RS=0W TA=250°C TA=Thigh(Note 1) TA=Tlow(Note 1) VIO - - - 2.0 - - 7.0 9.0 9.0 mV Average Temperature Coefficient of Input Offset Voltage TA=Thigh to Tlow(Note 1) ΔVIO/ΔT - 7 - µV/°C Input Offset Current Input Bias Current TA=Thigh to Tlow (Note 1) TA=Thigh to Tlow (Note 1) IIO - - - - 5.0 - -90 - 50 150 -250 -500 nA Average Temperature Coefficient of Input Offset Voltage TA=Thigh to Tlow (Note 1) - 10 - pA/°C Input Common Mode Voltage Range (Note 2) VCC=30V V=30V TA=Thigh to Tlow (Note 1) VICR 0 0 - - 28.3 28 V Differential Input Voltage Range VIDR - - VCC V Large Signal Open Loop Voltage Gain RL=2.0kW, VCC=15V, for Large VOSwing, TA=Thigh to Tlow (Note 1) AVOL 25 15 100 - - - V/mV Channel Separation 1.0kHz≤ f≤20kHz Input Referenced CS - -120 - dB Common Mode Rejection RS≤ 10kW CMR 65 70 - dB Power Supply Rejection PSR 65 100 - dB Output Voltage-High Limit (TA=Thigh to Tlow) (Note 1) VCC=5.0V, RL=2.0kW, TA=25°C VCC=30V, RL=2.0kW VCC=30V, RL=10kW VOH 3.3 26 27 3.5 - 28 - - - V Output Voltage-Low Limit VCC=5.0V, RL=10kW (TA=Thigh to Tlow) (Note 1) VOL - 5 20 mV Output Source Current VID=+1.0V, VCC=15V TA=25°C TA=Thigh to Tlow IO+ 20 10 40 20 - - mA Output Sink Current VID=-1.0V, VCC=15V TA=25°C TA=Thigh to Tlow VID=-1.0V, VCC=200mV IO- 10 5.0 12 20 8.0 50 - - mA µA Output Short Circuit to Ground (Note 3) ISC - 40 60 mA Power Supply Current TA=Thigh to Tlow (Note 1) VCC=30V, VO=0V, RL=¥ VCC=5.0V, VO=0V, RL=¥ ICC - - - - 3.0 1.2 mA Note1 Tlow=0°C for LM324, Thigh=+70°C for LM324 Note2 The input common mode voltage or either input signal voltage should not be allowed to go negative by more than 0.3V. The upper end of the common mode voltage range is VCC -1.7V. pan> SPICE MODEL CROSS REFERENCE PARTS GENERAL DIE INFORMATION Substrate Thickness [mils] Die size mils [mm] Bonding pads Backside metallization Silicon 10 62.992 x 59.843 ±1 [1.6 x 1.52] 3.543 x 3.543 mils, 1µm thick, aluminium Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. LM324 DIE LAYOUT - MECHANICAL SPECIFICATIONS LM324 DIE LAYOUT - MECHANICAL SPECIFICATIONS PAD # FUNCTION X(mils) X(mm) Y(mils) 1 #1 OUT 34.96 0.888 3.464 2 #1 IN- 56.102 1.425 7.283 3 #1 IN+ 56.102 1.425 20.511 4 VCC 56.102 1.425 28.031 5 #2 IN+ 56.102 1.425 35.787 6 #2 IN- 56.102 1.425 49.015 7 #2 OUT 34.96 0.888 52.834 8 #3 OUT 28.488 0.622 1.342 9 #3 IN- 3.346 0.085 1.245 10 #3 IN+ 3.346 0.085 0.909 11 GND 3.72 0.094 0.712 12 #4 IN+ 3.346 0.085 0.521 13 #4 IN- 3.346 0.085 0.185 14 #4 OUT 24.488 0.622 0.088 SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization. For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au. For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended. IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000. LM324 STANDARD PRODUCTS PRICE LIST USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($) USMLM324 100pc -WP 3.2 Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. /cgi-bin/rfq.cgi" method="post" target="new"> INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES /cgi-bin/getpdf.pl?part=SMXLM324&idx=30">PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated: Display settings for best viewing: Current display settings: Page hits: Screen resolution: 1124x864 Screen resolution: Total site visits: Color quality: 16 bit Color quality: bit © 1990- SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission. Valid XHTML 1.0 Transitional by http://validator.w3.org

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semiconix semiconductor - where the future is today - gold chip technology SMX LM324 - BARE DIE
GOLD CHIP TECHNOLOGY™ Low Power Quad Operational Amplifiers

FEATURES APPLICATIONS Quad Operational Amplifiers
Internally frequency compensated for unity gain
Large DC voltage gain 100dB
Wide bandwidth (unitygain) 1MHz
Very low supply current drain (700µA) - essentially independent of supply voltage
Low input biasing current 45 nA
Low input offset voltage 2mV and offset current 5nA



In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS









LM324 LM324 Low Power Quad Operational Amplifiers

SMXLM324 Low Power Quad Operational Amplifiers - PRODUCT DESCRIPTION
The SMX LM324 series are low cost, quad operational amplifiers with true differential inputs. They have several distinct advantages over standard operational amplifier types in single supply applications. The quad amplifier can operate at supply voltages as low as 3.0 V or as high as 32 V with quiescent currents about one fifth of those associated with the MC1741 (on a per amplifier basis). The common mode input range includes the negative supply, thereby eliminating the necessity for external biasing components in many applications. The output voltage range also includes the negative power supply voltage.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

SEMICONDUCTOR INTEGRATED CIRCUITS MANUFACTURING PROCESS
Semiconductor Integrated Circuits are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with other semiconductor devices on same chip to obtain standard and custom complex device solutions.


SCHEMATIC DIAGRAM
LM324 Texas Instruments LM324 Low Power Quad Operational Amplifiers

LM324 MAXIMUM RATINGS
PARAMETERSYMBOLVALUEUNITS
Power Supply VoltageVdc
Single SupplyVCC32V
Split SuppliesVCC,VEE±16V
Input Differential Voltage Range (Note 1)VDIR±32V
Input Common Mode Voltage RangeVICR-0.3 to 32V
Output Short Circuit DurationtSCContinuous 
Junction TemperatureTJ150°C
Storage Temperature RangeTstg-55 to +125°C
Operating Ambient Temperature RangeTA0 to +70°C
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

LM324 ELECTRICAL CHARACTERISTICS
TA=25°C unless otherwise specificed
PARAMETERTEST CONDITIONSSYMBOLMINTYPMAXUNITS
Input Offset VoltageVCC=5.0V to 30V VICR=0V to VCC=1.7V VO=1.4V, RS=0W TA=250°C TA=Thigh(Note 1) TA=Tlow(Note 1)VIO - - - 2.0 - - 7.0 9.0 9.0mV
Average Temperature Coefficient of Input Offset VoltageTA=Thigh to Tlow(Note 1)ΔVIO/ΔT-7-µV/°C
Input Offset Current Input Bias CurrentTA=Thigh to Tlow (Note 1) TA=Thigh to Tlow (Note 1)IIO- - - -5.0 - -90 -50 150 -250 -500nA
Average Temperature Coefficient of Input Offset VoltageTA=Thigh to Tlow (Note 1)-10-pA/°C
Input Common Mode Voltage Range (Note 2)VCC=30V V=30V TA=Thigh to Tlow (Note 1)VICR0 0- -28.3 28V
Differential Input Voltage RangeVIDR--VCCV
Large Signal Open Loop Voltage GainRL=2.0kW, VCC=15V, for Large VOSwing, TA=Thigh to Tlow (Note 1)AVOL25 15100 -- -V/mV
Channel Separation1.0kHz≤ f≤20kHz Input ReferencedCS--120-dB
Common Mode RejectionRS≤ 10kWCMR6570-dB
Power Supply RejectionPSR65100-dB
Output Voltage-High Limit(TA=Thigh to Tlow) (Note 1) VCC=5.0V, RL=2.0kW, TA=25°C VCC=30V, RL=2.0kW VCC=30V, RL=10kWVOH 3.3 26 27 3.5 - 28 - - -V
Output Voltage-Low LimitVCC=5.0V, RL=10kW (TA=Thigh to Tlow) (Note 1)VOL-520mV
Output Source CurrentVID=+1.0V, VCC=15V TA=25°C TA=Thigh to TlowIO+ 20 10 40 20 - -mA
Output Sink CurrentVID=-1.0V, VCC=15V TA=25°C TA=Thigh to Tlow VID=-1.0V, VCC=200mVIO- 10 5.0 12 20 8.0 50- -mA µA
Output Short Circuit to Ground (Note 3)ISC-4060mA
Power Supply CurrentTA=Thigh to Tlow (Note 1) VCC=30V, VO=0V, RL=¥ VCC=5.0V, VO=0V, RL=¥ICC - - - - 3.0 1.2mA
Note1 Tlow=0°C for LM324, Thigh=+70°C for LM324
Note2 The input common mode voltage or either input signal voltage should not be allowed to go negative by more than 0.3V. The upper end of the common mode voltage range is VCC -1.7V. pan>

SPICE MODEL
Spice model pending.
 
CROSS REFERENCE PARTS
BayLinear LM324, Fairchild Semiconductor LM324, Intersil LM324, Motorola LM324, National Semiconductor LM324, ON Semiconductor LM324, Philips LM324, SGS Thomson Microelectronics LM324, ST Microelectronics LM224A-LM324A, Texas Instruments LM324

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Die size
mils [mm]
Bonding pads Backside metallization
Silicon 10 62.992 x 59.843 ±1
[1.6 x 1.52]
3.543 x 3.543 mils, 1µm thick, aluminium Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.

LM324 DIE LAYOUT - MECHANICAL SPECIFICATIONSLM324 DIE LAYOUT - MECHANICAL SPECIFICATIONS
PAD #FUNCTIONX(mils)X(mm)Y(mils)
1#1 OUT34.960.8883.464
2#1 IN-56.1021.4257.283
3#1 IN+56.1021.42520.511
4VCC56.1021.42528.031
5#2 IN+56.1021.42535.787
6#2 IN-56.1021.42549.015
7#2 OUT34.960.88852.834
8#3 OUT28.4880.6221.342
9#3 IN-3.3460.0851.245
10#3 IN+3.3460.0850.909
11GND3.720.0940.712
12#4 IN+3.3460.0850.521
13#4 IN-3.3460.0850.185
14#4 OUT24.4880.6220.088

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization.
For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au.
For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used.
In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended.
IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000.

LM324 STANDARD PRODUCTS PRICE LIST
USM PART #MINIMUM ORDER QUANTITYWaffle PacksU/P($)
USMLM324100pc-WP3.2
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting SEMICONIX SEMICONDUCTOR technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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