Voltage Regulators: SMS500M1-5V LOW COST 500mA REGULATOR same as AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V SOT23-5L AMS Advanced Monolithic Systems AMS500M1-5V manufactured by Semiconix Semiconductor - Gold chip technology for known good Voltage Regulators die, Voltage Regulators flip chip, Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Voltage Regulators: SMS500M1-5V LOW COST 500mA REGULATOR same as AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V SOT23-5L AMS Advanced Monolithic Systems AMS500M1-5V manufactured by Semiconix Semiconductor - Gold chip technology for known good Voltage Regulators die, Voltage Regulators flip chip, Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. SOT23-5L AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V AMS Advanced Monolithic Systems AMS500M1-5V,SMS500M1-5V,500mA Voltage Regulators,,Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire Voltage Regulators: SMS500M1-5V LOW COST 500mA REGULATOR same as AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V SOT23-5L AMS Advanced Monolithic Systems AMS500M1-5V manufactured by Semiconix Semiconductor - Gold chip technology for known good Voltage Regulators die, Voltage Regulators flip chip, Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Voltage Regulators: SMS500M1-5V LOW COST 500mA REGULATOR same as AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V SOT23-5L AMS Advanced Monolithic Systems AMS500M1-5V manufactured by Semiconix Semiconductor - Gold chip technology for known good Voltage Regulators die, Voltage Regulators flip chip, Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. SOT23-5L AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V AMS Advanced Monolithic Systems AMS500M1-5V,SMS500M1-5V,500mA Voltage Regulators,,Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMS500M1-5V - BARE DIE GOLD CHIP TECHNOLOGY™ LOW COST 500mA REGULATOR FEATURES APPLICATIONS LOW COST 500mA REGULATOR - BARE DIE Fixed and Adjustable Versions Available Output Current up to 500mA Very Low Quiescent Current Reverse Battery Protection Input-output Differential less than 0.6V Short Circuit Protection Internal Thermal Overload Protection Overvoltage Protection ON/OFF Pin High reliability bare die Gold metallization RoHS compliant, Lead Free Compatible with chip and wire assemblies Cellular Telephones Portable Consumer Equipment Portable (Notebook) Computers Battery Powered Systems Portable Instrumentation Radio Control Systems CD/DVD drives Automotive Chip on Board System in package SIP Hybrid Circuits SMS500M1-5V AMS500M1-5V LOW COST 500mA REGULATOR Actual die layout may vary LOW COST 500mA REGULATOR - PRODUCT DESCRIPTION SMS500 series consists of positive fixed and adjustable voltage regulators ideally suited for use in battery-powered systems. These devices feature low quiescent current of 0.8mA or less when supplying 50mA loads. This unique characteristic and the low input-output differential required for proper regulation (0.2V for output currents of 100mA) make the SMS500 ideal to use for standby power systems. Internal circuitry of SMS500 is protected from input fault conditions caused by input voltages that exceed maximum rated input voltage. During line transients, when the input voltage to the regulator can momentarily exceed the specified maximum operating voltage, the regulator will automatically shut down to protect both internal circuits and the load. The SMS500 series also includes internal current limiting, thermal shutdown. The SMS500 is available in the 3-pin TO-92 package, SOT-89 and 5 lead SOT-23 packages and operates over the industrial temperature range. Voltage Regulators Integrated Circuits BD series products available in die form are ideal for high reliability hybrid circuits and multi chip module applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated) Parameter Symbol Value Unit Power Dissipation Internally Limited Input Voltage 25 V Overvoltage Protection 26 to 40 V Storage Temperature -65 to +150 °C Operating Junction Temperature 125 ° C Electrical Characteristics* at VIN=6.3V, IO=5mA, TJ=25°C, C2=22µF unless otherwise specified. Name Symbol Test Conditions Value Unit Min. Typ. Max Output Voltage Tolerance -4 4 % Line Regulation 6V≤VIN≤15V 5 10 mV Line Regulation 15V≤VIN≤25V 5 30 mV Load Regulation 5mA≤IO≤100 mA 5 25 mV Load Regulation 5mA≤10≤200 mA 15 40 mV Load Regulation 5mA≤10≤350 mA 20 60 mV Load Regulation 5mA≤10≤500 mA 20 75 mV Dropout Voltage (VIN - VOUT) IO=100 mA 0.25 0.4 mV Dropout Voltage (VIN - VOUT) IO=200 mA 0.4 0.5 mV Dropout Voltage (VIN - VOUT) IO=350 mA 0.45 0.6 mV Dropout Voltage (VIN - VOUT) IO=500 mA 0.55 0.8 mV Quiescent Current IO≤10 mA, 0.2 0.5 mA Quiescent Current IO=100 mA 2 4 mA Quiescent Current IO≤200 mA 5 10 mA Quiescent Current IO=350 mA 12 mA Ripple Rejection fO=120Hz 80 dB Output Noise Voltage 10Hz-100kHz, COUT=100µF 50 µVrms/V Output Bypass Capacitor ESR=0.1 to 10Ω 10 µF Maximum Operational Input Voltage RL=500Ω, VO≤5.5V 25 28 V Maximum Line Transient T=1ms, τ≤100ms 35 40 V Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: To ensure constant junction temperature, low duty cycle pulse testing is used. Note 3: Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for TA = TJ = 25°C. Note 4: The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to ambient thermal resistance θJ-A and the ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is calculated using: Where the value of the junction-to-ambient thermal resistance are as follows: 195°C/W for TO-92 (N), 110°C/W for SOT-89 (L), 90°C/W for SOT-223 and 220°C/W for SOT-23-5. SPICE MODEL AMS500M1-5V spice model pending. CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V GENERAL DIE INFORMATION Substrate Thickness [mils] Die size [mils] Bonding pads Backside metallization Silicon Si 10 1 101.2x61.8±1 [2.57x1.57±0.025] Pads are minimum 4x4mils, 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. P/N Metal Die attach process -BD0 Au/Si Au/Si eutectic -BD1 Ti/Pd/Au AuSn,AuGe -BD2 Ti/Pt/Au AuSn,AuGe -BD3 Ti/Ni/Au Soft Solder SAC -BD4 Ti/Pt/AuSn AuSn eutectic LAYOUT / DIMENSIONS / PAD LOCATIONS Actual die layout may vary SMS500M1-5V AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V AMS Advanced Monolithic Systems AMS500M1-5V LOW COST 500mA REGULATOR SMS500M1-5V AMS500M1-5V LOW COST 500mA REGULATOR Pad locations Pin # Function X [µm] Y [µm] X [mils] Y [mils] 1 In 275 1280 10.83 50.39 2 Out 275 90 10.83 3.54 3 GND 1765 90 69.49 3.54 4 On/Off 2295 90 90.35 3.54 SMS500M1-5V AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V AMS Advanced Monolithic Systems AMS500M1-5V LOW COST 500mA REGULATOR APPLICATION HINTS APPLICATION NOTES Definition of Terms Dropout Voltage: The input-output voltage differential at which the circuit stops to regulate against further reduction in input voltage. Measured when the output voltage has dropped 100mV from the nominal voltage obtained at 1V input, dropout voltage is dependent upon load current and junction temperature. Input Voltage: The DC voltage applied to the input terminal with respect to ground. Input-Output Differential: The voltage difference between the unregulated input voltage and the regulated output voltage for which the regulator will regulate. Line Regulation: The change in output voltage for a change in the input voltage. The line regulation is measured under conditions of low dissipation or by using low duty cycle pulse testing such that the average chip temperature is not significantly affected. Load Regulation: The change in output voltage for a change in load current at constant chip temperature. Long term stability: Output voltage stability under accelerated life-test conditions after 1000 hours with maximum rated voltage and junction temperature. Output Noise Voltage: The rms AC voltage at the output, with constant load and no input ripple, measured over a specified frequency range. Quiescent Current: That part of the positive input current that does not contribute to the positive load current. The regulator ground lead current. Ripple Rejection: The ratio of the peak-to -peak input ripple voltage to the peak-to-peak output ripple voltage at specified frequency. Temperature Stability of VO: The percentage change in output voltage for a thermal variation from room temperature to either temperature extreme. External capacitor The SMS3102 series require an output capacitor of 2.2µF or greater to ensure device stability. Without the capacitor the device may oscillate. Most type of tantalum or electrolytic capacitor can be used in the applications. A critical characteristic of the capacitors is an ESR value of 5Ω or less and a resonant frequency above 500kHz. The value of this capacitor can be increased without limits. For higher loads, the value of the capacitor should be increased, specially when the output voltage is set for 2.5V or less. The SMS3102 lowest fixed output voltage value is 2.0V. Minimum Load In circuits using the fixed output voltage versions, minimum load is not required. For circuits using the adjustable device, the value of R1 and R2 should be chosen such, that a current of approximately 40?A flows through the network. The reference voltage (1.235V) is measured between the adjust pin and VOUT. The output voltage can be set by the two resistors R1 and R2 using the following equation: Vout=Vref(1+R12/R2) The value of R1 is recommended to be between 25kΩ to 30kΩ, and the value of R2 will set the output voltage. Typical Application - Adjustable Output Figure 1: Typical Application - Adjustable Output Test Circuit for VREF vs IZ. Figure 2: Test Circuit for VREF vs IZ. Shunt Regulator Figure 3: Shunt Regulator Single Supply Comparator with Temperature Compensated Threshold Figure 4: Single Supply Comparator with Temperature Compensated Threshold Series Regulator Figure 5: Series Regulator Higher Current Shunt Regulator Figure 6: Higher Current Shunt Regulator Current Limiter or Current Source Figure 7: Current Limiter or Current Source Constant Current Sink Figure 8: Constant Current Sink Over/Under Voltage Protection Circuit Figure 9: Over/Under Voltage Protection Circuit Delay timer Figure 10: Delay timer SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization. For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au. For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended. IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000. STANDARD PRODUCTS ORDERING INFORMATION SMS P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($) SMS500M1-5V-BD -WP 1000 -FF 1000 SMS500M1-5V-BD -WP 5000 -FF 5000 PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice. LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated:January 01, 1970 Display settings for best viewing: Current display settings: Page hits: 1 Screen resolution: 1124x864 Screen resolution: Total site visits: 1 Color quality: 16 bit Color quality: bit © 1990-2009 SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission.

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semiconix semiconductor - where the future is today - gold chip technology SMS500M1-5V - BARE DIE
GOLD CHIP TECHNOLOGY™ LOW COST 500mA REGULATOR

FEATURES APPLICATIONS LOW COST 500mA REGULATOR - BARE DIE
Fixed and Adjustable Versions Available
Output Current up to 500mA
Very Low Quiescent Current
Reverse Battery Protection
Input-output Differential less than 0.6V
Short Circuit Protection
Internal Thermal Overload Protection
Overvoltage Protection
ON/OFF Pin
High reliability bare die
Gold metallization
RoHS compliant, Lead Free
Compatible with chip and wire assemblies
Cellular Telephones
Portable Consumer Equipment
Portable (Notebook) Computers
Battery Powered Systems
Portable Instrumentation
Radio Control Systems
CD/DVD drives
Automotive
Chip on Board
System in package SIP
Hybrid Circuits
SMS500M1-5V AMS500M1-5V LOW COST 500mA REGULATOR
Actual die layout may vary

LOW COST 500mA REGULATOR - PRODUCT DESCRIPTION
SMS500 series consists of positive fixed and adjustable voltage regulators ideally suited for use in battery-powered systems. These devices feature low quiescent current of 0.8mA or less when supplying 50mA loads. This unique characteristic and the low input-output differential required for proper regulation (0.2V for output currents of 100mA) make the SMS500 ideal to use for standby power systems. Internal circuitry of SMS500 is protected from input fault conditions caused by input voltages that exceed maximum rated input voltage. During line transients, when the input voltage to the regulator can momentarily exceed the specified maximum operating voltage, the regulator will automatically shut down to protect both internal circuits and the load. The SMS500 series also includes internal current limiting, thermal shutdown. The SMS500 is available in the 3-pin TO-92 package, SOT-89 and 5 lead SOT-23 packages and operates over the industrial temperature range.
Voltage Regulators Integrated Circuits BD series products available in die form are ideal for high reliability hybrid circuits and multi chip module applications.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS
Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions.

ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated)
Parameter Symbol Value Unit
Power Dissipation Internally Limited
Input Voltage 25 V
Overvoltage Protection 26 to 40 V
Storage Temperature -65 to +150 °C
Operating Junction Temperature 125 ° C

Electrical Characteristics* at VIN=6.3V, IO=5mA, TJ=25°C, C2=22µF unless otherwise specified.
Name Symbol Test Conditions Value Unit
Min. Typ. Max
Output Voltage Tolerance -4 4 %
Line Regulation 6V≤VIN≤15V 5 10 mV
Line Regulation 15V≤VIN≤25V 5 30 mV
Load Regulation 5mA≤IO≤100 mA 5 25 mV
Load Regulation 5mA≤10≤200 mA 15 40 mV
Load Regulation 5mA≤10≤350 mA 20 60 mV
Load Regulation 5mA≤10≤500 mA 20 75 mV
Dropout Voltage (VIN - VOUT) IO=100 mA 0.25 0.4 mV
Dropout Voltage (VIN - VOUT) IO=200 mA 0.4 0.5 mV
Dropout Voltage (VIN - VOUT) IO=350 mA 0.45 0.6 mV
Dropout Voltage (VIN - VOUT) IO=500 mA 0.55 0.8 mV
Quiescent Current IO≤10 mA, 0.2 0.5 mA
Quiescent Current IO=100 mA 2 4 mA
Quiescent Current IO≤200 mA 5 10 mA
Quiescent Current IO=350 mA 12 mA
Ripple Rejection fO=120Hz 80 dB
Output Noise Voltage 10Hz-100kHz, COUT=100µF 50 µVrms/V
Output Bypass Capacitor ESR=0.1 to 10Ω 10 µF
Maximum Operational Input Voltage RL=500Ω, VO≤5.5V 25 28 V
Maximum Line Transient T=1ms, τ≤100ms 35 40 V
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 2: To ensure constant junction temperature, low duty cycle pulse testing is used.
Note 3: Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for TA = TJ =
25°C.
Note 4: The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to ambient thermal resistance θJ-A
and the ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is calculated using:
Where the value of the junction-to-ambient thermal resistance are as follows: 195°C/W for TO-92 (N), 110°C/W for SOT-89 (L), 90°C/W for SOT-223 and
220°C/W for SOT-23-5.
SPICE MODEL
Spice model pending.
CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Die size
[mils]
Bonding pads Backside metallization
Silicon
Si
10 1 101.2x61.8±1
[2.57x1.57±0.025]
Pads are minimum 4x4mils, 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion.
P/N MetalDie attach process
-BD0Au/SiAu/Si eutectic
-BD1Ti/Pd/AuAuSn,AuGe
-BD2Ti/Pt/AuAuSn,AuGe
-BD3Ti/Ni/AuSoft Solder SAC
-BD4Ti/Pt/AuSnAuSn eutectic

LAYOUT / DIMENSIONS / PAD LOCATIONS
Actual die layout may vary
SMS500M1-5V AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V AMS Advanced Monolithic Systems AMS500M1-5V LOW COST 500mA REGULATOR SMS500M1-5V AMS500M1-5V LOW COST 500mA REGULATOR
Pad locations
Pin # Function X [µm] Y [µm] X [mils] Y [mils]
1 In 275 1280 10.83 50.39
2 Out 275 90 10.83 3.54
3 GND 1765 90 69.49 3.54
4 On/Off 2295 90 90.35 3.54
SMS500M1-5V AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V, AMS Advanced Monolithic Systems AMS500M1-5V AMS Advanced Monolithic Systems AMS500M1-5V LOW COST 500mA REGULATOR

APPLICATION HINTS

APPLICATION NOTES 


Definition of Terms

Dropout Voltage: The input-output voltage differential at which the circuit stops to regulate against further reduction in input voltage. Measured when the output voltage has dropped 100mV from the nominal voltage obtained at 1V input, dropout voltage is dependent upon load current and junction temperature.
Input Voltage: The DC voltage applied to the input terminal with respect to ground.
Input-Output Differential: The voltage difference between the unregulated input voltage and the regulated output voltage for which the regulator will regulate.
Line Regulation: The change in output voltage for a change in the input voltage. The line regulation is measured under conditions of low dissipation or by using low duty cycle pulse testing such that the average chip temperature is not significantly affected.
Load Regulation: The change in output voltage for a change in load current at constant chip temperature.
Long term stability: Output voltage stability under accelerated life-test conditions after 1000 hours with maximum rated voltage and junction temperature.
Output Noise Voltage: The rms AC voltage at the output, with constant load and no input ripple, measured over a specified frequency range.
Quiescent Current: That part of the positive input current that does not contribute to the positive load current. The regulator ground lead current.
Ripple Rejection: The ratio of the peak-to -peak input ripple voltage to the peak-to-peak output ripple voltage at specified frequency.
Temperature Stability of VO: The percentage change in output voltage for a thermal variation from room temperature to either temperature extreme.

External capacitor

The SMS3102 series require an output capacitor of 2.2µF or greater to ensure device stability. Without the capacitor the device may oscillate.
Most type of tantalum or electrolytic capacitor can be used in the applications. A critical characteristic of the capacitors is an ESR value of 5Ω or
less and a resonant frequency above 500kHz. The value of this capacitor can be increased without limits. For higher loads, the value of the capacitor should
be increased, specially when the output voltage is set for 2.5V or less. The SMS3102 lowest fixed output voltage value is 2.0V.


Minimum Load

In circuits using the fixed output voltage versions, minimum load is not required. For circuits using the adjustable device, the value of R1 and R2 should
be chosen such, that a current of approximately 40?A flows through the network. The reference voltage (1.235V) is measured between the adjust pin and VOUT.
The output voltage can be set by the two resistors R1 and R2 using the following equation:
Vout=Vref(1+R12/R2)
The value of R1 is recommended to be between 25kΩ to 30kΩ, and the value of R2 will set the output voltage.
Typical Application - Adjustable Output
Figure 1: Typical Application - Adjustable Output
Test Circuit for VREF vs IZ.
Figure 2: Test Circuit for VREF vs IZ.
Shunt Regulator
Figure 3: Shunt Regulator
Single Supply Comparator with Temperature Compensated Threshold
Figure 4: Single Supply Comparator with Temperature Compensated Threshold
Series Regulator
Figure 5: Series Regulator
Higher Current Shunt Regulator
Figure 6: Higher Current Shunt Regulator
Current Limiter or Current Source
Figure 7: Current Limiter or Current Source
Constant Current Sink
Figure 8: Constant Current Sink
Over/Under Voltage Protection Circuit
Figure 9: Over/Under Voltage Protection Circuit
Delay timer
Figure 10: Delay timer

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization.
For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au.
For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used.
In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended.
IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000.

STANDARD PRODUCTS ORDERING INFORMATION

SMS P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($)
SMS500M1-5V-BD -WP 1000 -FF 1000
SMS500M1-5V-BD -WP 5000 -FF 5000

PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.
LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times.
CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met.
CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page.
SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.
ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts.
SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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