Voltage Regulators: SMS78L08N 100mA VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N SOT89 AMS Advanced Monolithic Systems AMS78L08N manufactured by Semiconix Semiconductor - Gold chip technology for known good Voltage Regulators die, Voltage Regulators flip chip, Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Voltage Regulators: SMS78L08N 100mA VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N SOT89 AMS Advanced Monolithic Systems AMS78L08N manufactured by Semiconix Semiconductor - Gold chip technology for known good Voltage Regulators die, Voltage Regulators flip chip, Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. SOT89 AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N AMS Advanced Monolithic Systems AMS78L08N,SMS78L08N,100mA Voltage Regulators,,Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire Voltage Regulators: SMS78L08N 100mA VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N SOT89 AMS Advanced Monolithic Systems AMS78L08N manufactured by Semiconix Semiconductor - Gold chip technology for known good Voltage Regulators die, Voltage Regulators flip chip, Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Voltage Regulators: SMS78L08N 100mA VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N SOT89 AMS Advanced Monolithic Systems AMS78L08N manufactured by Semiconix Semiconductor - Gold chip technology for known good Voltage Regulators die, Voltage Regulators flip chip, Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. SOT89 AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N AMS Advanced Monolithic Systems AMS78L08N,SMS78L08N,100mA Voltage Regulators,,Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMS78L08N - FLIP CHIP GOLD CHIP TECHNOLOGY™ 100mA VOLTAGE REGULATOR FEATURES APPLICATIONS 100mA Voltage Regulators - FLIP CHIP 5.0V, 6.2V and 8.0V Output Voltage Available Output Voltage Tolerance of ±5% Over Temperature Output Current in excess of 100mA Internal Thermal Overload Protection Overvoltage Protection Short Circuit protection High reliability Unique new design in 0805 style case Gold metallization RoHS compliant, Lead Free Compatible with both chip and wire, flip chip and surface mount assembly. Battery Powered Systems Portable Consumer Equipment Cordless Telephones Portable (Notebook) Computers Portable Instrumentation Radio Control Systems Logic Systems Chip on Board System in package SIP Hybrid Circuits SMS78L08N AMS78L08N 100mA VOLTAGE REGULATOR 100mA VOLTAGE REGULATOR - PRODUCT DESCRIPTION SMS78L08 series consists of positive fixed voltage regulators ideally suited for use in battery-powered systems. These devices feature very low quiescent current of 1mA or less when supplying 10mA loads. This unique characteristic and the low input -output differential of less than 1V required for proper regulation, make the SMS78L08 ideal to use for standby power systems and portable equipment. Offering a low cost solution for a variety of design needs, the SMS78L08 series includes internal current limiting, over voltage protection, thermal shutdown, and is able to withstand temporary power-up with mirror-image insertion. The SMS78L08 series is offered in the 3-pin TO-92 package, 8-pin plastic SOIC and SOT-89 packages. Flip Chip Voltage Regulators Integrated Circuits series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated) Parameter Symbol Value Unit Power Dissipation Internally Limited Input Voltage 24 V Storage Temperature -65 to +150 °C Operating Junction Temperature 125 ° C Operating Temperature Range 0 to 125 ° C Electrical Characteristics* at VIN=13V, IO=10mA, TJ=25°C, C1=0.33µF, CO=10µF unless otherwise specified. Name Symbol Test Conditions Value Unit Min. Typ. Max Output Voltage 7.6 8 8.4 V Output Voltage, over the full operating temperature range. 11V≤VIN≤20V, IO=100 mA,-40°C≤TJ≤125°C 7.6 8.4 V Line Regulation 11V≤VIN≤23V 80 175 mV Line Regulation 12V≤VIN≤23V 70 125 mV Load Regulation 1mA≤IO≤100 mA 15 80 mV Load Regulation 1mA≤IO≤40 mA 8 40 mV Quiescent Current 0.6 1 mA Ripple Rejection fO=120Hz,12V≤VIN≤22V 39 45 dB Output Noise Voltage 10Hz-100kHz 60 µV Peak Output Current 200 mA Average Output Voltage Tempco IO=5 mA -0.78 mV/°C Minimum Value of Input Voltage Required to Maintain Line Regulation 9 9.5 V Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: See Circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used. Note 3: Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for TA = TJ = 25°C. Note 4: The junction-to-ambient thermal resistance are as follows: 195°C/W for the TO-92 (N) package, 160°C/W for the molded plastic SO-8 (S), 150°C/W for the SOT-89 package. SPICE MODEL AMS78L08N spice model pending. CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N GENERAL DIE INFORMATION Substrate Thickness [mils] Size LxW[mils] Bonding pads dimensions per drawing Backside Silicon Si 10±2 39x47±1 [1x1.2±0.025] Type Pad metal Thickness Assembly -FC TiW/Au 4µm±1 Wire bonding or Silver epoxy -GB TiW/Au 25µm±2.5 Thermosonic -GT Ti/Pt/AuSn 5µm±1 Reflow -AN Ni/Au 5µm±1 Solder reflow Optional backside coating and/or marking. LAYOUT / DIMENSIONS / PAD LOCATIONS Click to select process: -FC -GB -GT -AN SMS78L08N AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N AMS Advanced Monolithic Systems AMS78L08N 100mA VOLTAGE REGULATOR SMS78L08N AMS78L08N 100mA VOLTAGE REGULATOR wire bonding SMS78L08N AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N AMS Advanced Monolithic Systems AMS78L08N 100mA VOLTAGE REGULATORthermosonic SMS78L08N AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N AMS Advanced Monolithic Systems AMS78L08N 100mA VOLTAGE REGULATORthermal SMS78L08N AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N AMS Advanced Monolithic Systems AMS78L08N 100mA VOLTAGE REGULATORsolder reflow SMS78L08N AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N AMS Advanced Monolithic Systems AMS78L08N 100mA VOLTAGE REGULATOR APPLICATION HINTS TYPICAL APPLICATIONS Fixed Output Regulator Input capacitor required if regulator is located far from power supply filter. Output capacitor must be at least 10µF to maintain stability, it can be increased without bound to maintain regulation during transients and it should be located as close as possible to the regulator. This capacitor must be rated over the same operating temperature range like the regulator. Current Regulator Iout = (Vout/R1)+Iq Iq = 1.5mA over line and load changes Fixed Output Regulator Figure 1: Fixed Output Regulator Current Regulator Figure 2: Current Regulator SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. Semiconix Flip Chip -FC series can be also used for thermosonic wire bonding. Semiconix Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. Semiconix Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process. Semiconix -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications. Semiconix Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc. Semiconix Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages. STANDARD PRODUCTS ORDERING INFORMATION VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($) Flip chip SMS78L08N-FC -WP 1000 -FF 1000 Flip chip SMS78L08N-FC -WP 5000 -FF 5000 Gold Bump SMS78L08N-GB -WP 1000 -FF 1000 Gold Bump SMS78L08N-GB -WP 5000 -FF 5000 Gold-Tin SMS78L08N-GT -WP 1000 -FF 1000 Gold-Tin SMS78L08N-GT -WP 5000 -FF 5000 Gold/Nickel SMS78L08N-AN -WP 1000 -FF 1000 Gold/Nickel SMS78L08N-AN -WP 5000 -FF 5000 PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice. LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated:January 01, 1970 Display settings for best viewing: Current display settings: Page hits: 1 Screen resolution: 1124x864 Screen resolution: Total site visits: 1 Color quality: 16 bit Color quality: bit 1990-2009 SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission.

REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP

   
semiconix semiconductor - where the future is today - gold chip technology SMS78L08N - FLIP CHIP
GOLD CHIP TECHNOLOGY™ 100mA VOLTAGE REGULATOR

FEATURES APPLICATIONS 100mA Voltage Regulators - FLIP CHIP
5.0V, 6.2V and 8.0V Output Voltage Available
Output Voltage Tolerance of ±5% Over Temperature
Output Current in excess of 100mA
Internal Thermal Overload Protection
Overvoltage Protection
Short Circuit protection
High reliability
Unique new design in 0805 style case
Gold metallization
RoHS compliant, Lead Free
Compatible with both chip and wire, flip chip and surface mount assembly.
Battery Powered Systems
Portable Consumer Equipment
Cordless Telephones
Portable (Notebook) Computers
Portable Instrumentation
Radio Control Systems
Logic Systems
Chip on Board
System in package SIP
Hybrid Circuits
SMS78L08N AMS78L08N 100mA VOLTAGE REGULATOR

100mA VOLTAGE REGULATOR - PRODUCT DESCRIPTION
SMS78L08 series consists of positive fixed voltage regulators ideally suited for use in battery-powered systems. These devices feature very low quiescent current of 1mA or less when supplying 10mA loads. This unique characteristic and the low input -output differential of less than 1V required for proper regulation, make the SMS78L08 ideal to use for standby power systems and portable equipment. Offering a low cost solution for a variety of design needs, the SMS78L08 series includes internal current limiting, over voltage protection, thermal shutdown, and is able to withstand temporary power-up with mirror-image insertion. The SMS78L08 series is offered in the 3-pin TO-92 package, 8-pin plastic SOIC and SOT-89 packages.
Flip Chip Voltage Regulators Integrated Circuits series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS
Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions.

ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated)
Parameter Symbol Value Unit
Power Dissipation Internally Limited
Input Voltage 24 V
Storage Temperature -65 to +150 °C
Operating Junction Temperature 125 ° C
Operating Temperature Range 0 to 125 ° C

Electrical Characteristics* at VIN=13V, IO=10mA, TJ=25°C, C1=0.33µF, CO=10µF unless otherwise specified.
Name Symbol Test Conditions Value Unit
Min. Typ. Max
Output Voltage 7.6 8 8.4 V
Output Voltage, over the full operating temperature range. 11V≤VIN≤20V, IO=100 mA,-40°C≤TJ≤125°C 7.6 8.4 V
Line Regulation 11V≤VIN≤23V 80 175 mV
Line Regulation 12V≤VIN≤23V 70 125 mV
Load Regulation 1mA≤IO≤100 mA 15 80 mV
Load Regulation 1mA≤IO≤40 mA 8 40 mV
Quiescent Current 0.6 1 mA
Ripple Rejection fO=120Hz,12V≤VIN≤22V 39 45 dB
Output Noise Voltage 10Hz-100kHz 60 µV
Peak Output Current 200 mA
Average Output Voltage Tempco IO=5 mA -0.78 mV/°C
Minimum Value of Input Voltage Required to Maintain Line Regulation 9 9.5 V
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. For guaranteed performance limits and associated test
conditions, see the Electrical Characteristics tables.
Note 2: See Circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
Note 3: Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for TA = TJ =
25°C.
Note 4: The junction-to-ambient thermal resistance are as follows: 195°C/W for the TO-92 (N) package, 160°C/W for the molded plastic SO-8 (S), 150°C/W
for the SOT-89 package.
SPICE MODEL
Spice model pending.
CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Size
LxW[mils]
Bonding pads dimensions per drawing Backside
Silicon
Si
10±2 39x47±1
[1x1.2±0.025]
TypePad metalThicknessAssembly
-FCTiW/Au4µm±1Wire bonding or Silver epoxy
-GBTiW/Au25µm±2.5Thermosonic
-GTTi/Pt/AuSn5µm±1Reflow
-ANNi/Au5µm±1Solder reflow
Optional backside coating and/or marking.

LAYOUT / DIMENSIONS / PAD LOCATIONS
Click to select process: -FC -GB -GT -AN
SMS78L08N AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N AMS Advanced Monolithic Systems AMS78L08N 100mA VOLTAGE REGULATOR SMS78L08N AMS78L08N 100mA VOLTAGE REGULATOR
wire bonding SMS78L08N AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N, AMS Advanced Monolithic Systems AMS78L08N AMS Advanced Monolithic Systems AMS78L08N 100mA VOLTAGE REGULATOR

APPLICATION HINTS

TYPICAL APPLICATIONS



Fixed Output Regulator

Input capacitor required if regulator is located far from power supply filter.
Output capacitor must be at least 10µF to maintain stability, it can be increased without bound to maintain regulation during transients and it should be located as close as possible to the regulator. This capacitor must be rated over the same operating temperature range like the regulator.

Current Regulator
Iout = (Vout/R1)+Iq
Iq = 1.5mA over line and load changes
Fixed Output Regulator
Figure 1: Fixed Output Regulator
Current Regulator
Figure 2: Current Regulator

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
Semiconix flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. Semiconix Flip Chip -FC series can be also used for thermosonic wire bonding. Semiconix Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. Semiconix Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process.
Semiconix -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications.
Semiconix Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc.
Semiconix Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages.

STANDARD PRODUCTS ORDERING INFORMATION

VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($)
Flip chip SMS78L08N-FC -WP 1000 -FF 1000
Flip chip SMS78L08N-FC -WP 5000 -FF 5000
Gold Bump SMS78L08N-GB -WP 1000 -FF 1000
Gold Bump SMS78L08N-GB -WP 5000 -FF 5000
Gold-Tin SMS78L08N-GT -WP 1000 -FF 1000
Gold-Tin SMS78L08N-GT -WP 5000 -FF 5000
Gold/Nickel SMS78L08N-AN -WP 1000 -FF 1000
Gold/Nickel SMS78L08N-AN -WP 5000 -FF 5000

PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.
LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times.
CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met.
CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page.
SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.
ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts.
SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

HOME PRODUCT TREE PACKAGES PDF VERSION SEARCH

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